A Professor at Syracuse University, Shalabh Maroo, his research group, and collaborators at NIST and RPI have “created a single vapor bubble in a pool of liquid that can remain stable on a surface for hours, instead of milliseconds," reported Nanowerk.com. The group used a focused laser beam to put boiling on pause, which will give researchers “the time necessary to … [Read more...]
Company CEO Asks “Is Free Cooling Really Free?” At Conference
CEO of LiquidCooling Solutions, Inc., Herb Zien, is serving on a panel until Thursday, Sept. 24, at the North America’s Emerging Green Conference in Portland, Oregon. On Wednesday Sept. 23, from 1:30 – 3:00 p.m., Zien will give a presentation that challenges the legitimacy of Free Cooling. Zien will explain inefficiencies and environmental waste associated with free cooling via … [Read more...]
Comparison of HPC and Telecom Data Center Cooling Methods by Operating and Capital Expense Extended Article
Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance … [Read more...]
Liquid Immersion in the Data Center: A Modular Approach for Cooling High-Performance Microelectronics
Introduction While data enter energy consumption is already significant, the growth of a global cloud-based economy along with society’s need for constant social networking connectivity will cause this number to rise even further. The world’s Information-Communications-Technologies (ICT) infrastructure, a general representation of cloud-based computing, is estimated to … [Read more...]
Advances in Vapor Compression Electronics Cooling
INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices. As this energy density has gone up, so has the heat dissipation on electronics packages. In response to this challenge, significant research has taken place to develop chip level cooling systems to meet heat fluxes in excess of 1000W/cm2. As stated … [Read more...]
