INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices. As this energy density has gone up, so has the heat dissipation on electronics packages. In response to this challenge, significant research has taken place to develop chip level cooling systems to meet heat fluxes in excess of 1000W/cm2. As stated … [Read more...]
Thermal Management of Many-Core Processors Using Power Multiplexing
Man Prakash Gupta and Satish Kumar G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology INTRODUCTION Due to the growing demands of higher performance and faster computing, the number of cores in a microprocessor chip has been increasing consistently. The transition from single core to multi-core technology has already been observed in the past few … [Read more...]
Patent Awarded for Free Cooling Solution for a Containerized Data Center
The U.S. Patent and Trademark Office has awarded patent No. 8,554,390, “Free Cooling Solution for a Containerized Data Center,” to the International Business Machines Corporation in Armonk, N.Y., USA. “There is a problem in that the cost of operating today's data centers continues to rise and come under closer and closer scrutiny,” the inventors explain in their summary. … [Read more...]
Electronic Performance Impact of Elevated Humidity Environments – Implications for Free Air Cooling of Data Centers
Introduction The computer industry is exploring various options for reducing the cost and energy consumption associated with cooling data centers. The use of liquid cooling in the data center has long been exploited as a more energy efficient means of heat removal than forced air cooling. However, more recently, there has been considerable interest in cooling data centers by … [Read more...]
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