(June 3, 2016) Because electronics have shrunk significantly in recent years, the solutions to cool them must be adjusted. Electropages.com suggests “a case-specific analysis must be performed as each application is subject to different circumstances,” to determine the right strategy for cooling electronics. This analysis is called “CFD analysis,” or computational fluid … [Read more...]
Industry’s First Portable Measurement Equipment to Improve Thermal Efficiency
SANYO DENKI has recently developed and launched the first portable measuring equipment that measures the system impedance and operating airflow of devices. The San Ace Airflow Tester claims to “improve the thermal efficiency of a device” by “measuring the system impedance and operating airflow of devices” according to Sanyo Denki. It is compact and lightweight, and has the … [Read more...]
New Market Entry of Sealed Enclosure Coolers
As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their new products: “ACT’s HSC series of coolers are based on a patent pending design that utilizes the air impingement technology that is thermally efficient and … [Read more...]
New Energy Efficient Air-to-Air Outdoor Cooler Released
Laird has released its new air-to-air outdoor cooler, the AA-480 Series, that is smaller and more energy efficient than similar units on the market. The cooler has “480 Watts of cooling power and a Coefficient of Performance (COP) rating of 1, and an operating temperature range of -40°C to +55°C,” according to the company, “It has been designed to pass Telcordia test … [Read more...]
Registration for Thermal Conference Opens
ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. According to the … [Read more...]
