Cooler Master’s Hyper 212 EVO and Hyper TX3 EVO CPU Coolers have an improved tower fin design, heat pipe layout, upgraded fans and fan brackets. All of which provides an even more extreme value for end-users of all types. The Hyper 212 & TX3 EVO cooling systems are designed and optimized to provide the best user experience and cooling potential for a new generation of … [Read more...]
NASA Investigates Use of Heat Pipes on Space Station
Scientists launched an investigation called the Constrained Vapor Bubble, or CVB, to the International Space Station to look into the operation of a heat pipe in space. The Constrained Vapor Bubble is the prototype for a wickless heat pipe and is the first full-scale fluids study in the Fluids Integrated Rack or FIR facility flown on the U.S. module of the space station. Nearly … [Read more...]
Heat Pipe-Assisted Heat Sinks for Power Electronics Cooling
Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heat sinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated turn-off thyristors (SGCTs), and silicon controlled rectifiers (SCRs). Power electronic … [Read more...]
Grapics Card Series Uses Heat Pipes to Cool GPU More Efficiently
The R6850-PM2D1GD5, part of the R6800 series of graphics cards recently launched by mainboard and graphics card manufacturer MSI, uses direct contact heat pipes to more efficiently cool the GPU. A 9cm PWM fan provides 50% more airflow compared to the reference design. Overall, this results in 10% lower temperatures of the graphics core. The MSI R6800 series of graphics cards … [Read more...]
Apple Gets Patent on Method of Cooling Electronic Devices
Apple Inc., maker of the iPhone and the iPad, received a patent on a method of cooling an electronic device by using hinge assemblies that can conduct heat. Patent 7,746,631, which was issued June 29, covers the use of a variety of cooling components within a hinge assembly. According to the patent, these could include fans, heat sinks, heat spreaders, heat pipes, vents or … [Read more...]
- « Previous Page
- 1
- …
- 16
- 17
- 18
- 19
- 20
- …
- 22
- Next Page »