Introduction Often in high power density or low profile heat sink applications, the spreading resistances in the base of the heat sink limits the performance of the design. Once it is determined that normal heat sink materials, aluminum or copper, are either insufficient or too bulky to meet the design objectives, the obvious next step is to look at two phase … [Read more...]
Integrated Heat Pipe Spreader for Improved FBDIMM Memory Module Thermal Management
Introduction Due to the increasing power density in today's industry standard servers, thermal design and cooling is a significant challenge. In a typical server, the two most challenging elements to cool are the processors and the memory modules. The system level fan speeds are directly dictated (in most cases) by both processor and memory temperatures. Due to the fact that … [Read more...]
Pushing the Boundaries of Heat Pipe Operation
Introduction Heat pipes are well-established two-phase devices used in the electronics cooling industry to transport heat from the point it is generated to the place where it is extracted from the system. Three wick structures are most commonly used to provide the capillary path for the liquid return to evaporation section; these are sintered powder, screen mesh and grooved … [Read more...]
Modeling Air-Cooled Heat Sinks As Heat Exchangers
Introduction The thermal resistance of a heat sink is a convenient way of describing its performance but, unlike its electrical counterpart, the thermal resistance of a heat sink is not a constant: it changes significantly with air flow. How we "understand" heat sinks is revealed by the models we use to describe their thermal resistance. Most thermal engineers use a single-term … [Read more...]
Advances In High-Performance Cooling For Electronics
Introduction The need for new cooling techniques is driven by the continuing increases in power dissipation of electronic parts and systems. In many instances standard techniques cannot achieve the required cooling performance due to physical limitations in heat transfer capabilities. These limitations are principally related to the limited thermal conductivity of air for … [Read more...]
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