Bonnie Mack and Terence Graham 1. Introduction Pluggable optics modules, (POMs), such as SFP, QSFP, QSFP+, QSFP28, CFP, CFP2, and CFP4 transceivers, are optical interface devices that are connected to a PCB through ports in the faceplate. A brief description of these modules is given in Table 1. Initially conceived as low power devices, the module power density has increased … [Read more...]
Special Adhesives to Better Medical Equipment
(June 13, 2016) Device manufacturers are making more accurate, compact medical equipment with electronics technology. MedicalPlasticsNews.com reported that they are using “pressure-sensitive adhesives (PSAs)” which were “developed as a heat sink attachment method to eliminate the need for clamping” for “interconnects, grounding and shielding applications in medical … [Read more...]
How to Choose the Right Solution for Effective Heat Management
(June 3, 2016) Because electronics have shrunk significantly in recent years, the solutions to cool them must be adjusted. Electropages.com suggests “a case-specific analysis must be performed as each application is subject to different circumstances,” to determine the right strategy for cooling electronics. This analysis is called “CFD analysis,” or computational fluid … [Read more...]
New Skived-Copper Fan Heat-sink Keeps Intel Servers Cool
JARO has recently released their new low-profile, 1U CPU cooler with a heat-sink and blower, model JCC00066. Specifically designed for use with data storage, high-density, backup, or cloud servers, JARO’s cooler works well for Intel processors that interact with square socket (2011) types. The high-quality coolers come in two sizes, one of which provides a narrow heat-sink … [Read more...]
New Market Entry of Sealed Enclosure Coolers
As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their new products: “ACT’s HSC series of coolers are based on a patent pending design that utilizes the air impingement technology that is thermally efficient and … [Read more...]
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