Introduction The advancement of artificial intelligence (AI) has led to an accelerating development of high-performance AI chips, which are increasingly characterized by ultra-large die areas, extreme interconnect density, and high-power consumptions. Heat dissipation is a bottleneck for the next-generation high-power graphics processing unit (GPU) and necessitates advanced … [Read more...]
Performing a Transient Thermal Characterization of Hardware with a Finite Difference Model
Introduction A transient thermal characterization, also known as a thermal survey, aims to characterize the location of greatest thermal inertia within a hardware system—that is, the location with the slowest temperature response to a given environmental stimulus. This manuscript outlines a methodology for developing a finite difference numerical model of a three-resistor, … [Read more...]
Direct Liquid Cooling for High-Compute Servers
In today's technological landscape, the demand for high performance computing continues to soar, driven by advances in artificial intelligence, data analytics, and complex simulations. As processors become more powerful, there has been a rise in the power draw of the servers. To increase the compute capability of the data centers, there is a constant push to increase the rack … [Read more...]
Summary of SEMI-THERM 41 Conference
By Navid Kazem, Lieven Vervecken, and Claire Wemp The SEMI-THERM 41 Symposium was held March 10-13, 2025 at the Double Tree Hotel in San Jose, CA. Program organization was led by General Chair Lieven Vervecken (Diabatix), Program Chair Dr. Navid Kazem (Arieca), and Program Vice Chair Dr. Claire Wemp (DuPont). It featured a variety of activities including technical short … [Read more...]
Alloy Enterprises Unveils Copper Direct Liquid Cooling, Slashing AI Data Center Energy Use and Eliminating the Need for HVAC
Alloy Enterprises, a manufacturing company revolutionizing data center cooling with its novel Stack Forging™ process, today introduced a new copper direct liquid cooling (DLC) solution. As chip power densities and thermal design power rise—pushing AI server rack power densities beyond 120 kW—traditional cooling methods are reaching their limits. With Stack Forging, Alloy … [Read more...]
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