(July 18, 2016) A 3D printed smartphone case that may better support and cool smartphones has recently been designed and prototype printed. Made to look like a real life Pokédex, SparkFun user NPOOLE created the battery pack with the intention of helping Pokemon Go players play for longer amounts of time. The case fits a Samsung Galaxy S4 and “hides a 2,600 mAh battery pack” … [Read more...]
3D Printed Heat Sink Performs as Well as Conventional Heat Sinks with Annealing Process
(July 8, 2016) Recently, Tong Wu, of the University of Tennessee and Oak Ridge National Laboratory, led a team of researchers who have discovered that manufacturers can create 3D printed heat sinks that can perform as well as conventional heat sinks by employing an annealing process. The research project compared the performance of 3D printed aluminum heat sinks to non-printed … [Read more...]
Software Update Leads to Device Failure by Overheating
(April 29, 2016) The new Nextfit Robin, an Android-based smartphone, experienced a major cooling malfunction after a recent software update which resulted in the phones overheating. The device normally heats up a bit when performing everyday tasks, and the update was supposed to improve its cooling process, but when users downloaded it and restarted their devices, they “failed … [Read more...]
New Power Electronics Will Allow Army Vehicles’ Electronics to Operate at High Temperatures
The US Army has awarded GE Aviation with a contract to develop silicon carbide-based power electronics that will allow high-voltage, next-generation ground vehicles to operate at higher temperatures. "The US Army's implementation of [this technology for] more electric ground vehicles, facilitates significant improvements in size, weight and power for high temperature … [Read more...]
Overcoming Cooling Challenges Downloadable Webinar Now Available
The recent Electronics Cooling with Autodesk CFD Webinar on how to ensure proper cooling as the electronics used in products change and improve is now available for download. Exploring ‘invisible elements’ like airflow and heat transfer, speaker Jim Byrne talks through how to maximize product performance by overcoming common electronics challenges like reduction in product … [Read more...]
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