(August 8, 2016) The minimum efficiency standards for general-purpose, three-phase motors have been raised. “The U.S. Department of Energy (DoE) recently released new efficiency standards for commercial and industrial pumps that are based on efficiency levels negotiated by manufacturers, efficiency advocates, and other stakeholders,” reported MachineDesign.com, “In addition to … [Read more...]
Tech Brief: Visualization of Flow Boiling of R245fa in a Microgap with Integrated Staggered Pin Fins
Pouya Asrar *, Xuchen Zhang, Craig E. Green, Peter A. Kottke, Thomas E. Sarvey, Andrei Fedorov, Muhannad S. Bakir, and Yogendra K. Joshi* Introduction Two phase cooling has become a promising technique for managing high heat fluxes from electronic packages such as 3D stacked chips. Flow boiling in microchannel arrays has been employed in many applications[1-3], and boiling … [Read more...]
New Website for Unique Product Line
Developer of cooling solutions for high-powered electronics, QuantaCool, has selected Schubert b2b to design a new website to support the company as it goes to market with its PolarBox™, PolarRak™ and PolarMax™ product lines. “QuantaCool’s cooling systems use patented microchannel heat pipe (MHP™) technology to transfer large quantities of heat from the source,” explained the … [Read more...]
New Refrigerant-Based Rack and Row Cooling Solution for IT Equipment
Rittal Corporation has recently introduced a new refrigerant-based rack and row cooling solution, LCP DX, for heat removal of critical IT components. The Rittal Rack LCP DX “puts the cooling only where needed to protect valuable IT equipment while minimizing energy costs” and “includes air-flow optimized enclosures with includes baffles and blanking panels,” said the … [Read more...]
Registration for Thermal Conference Opens
ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. According to the … [Read more...]
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