Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance … [Read more...]
Superconducting Refrigerator Cools via Tunneling Cascade
Researchers from Italy and France have proposed a new design for a superconducting refrigerator that uses a series of steps to more effectively cool objects down to temperatures near absolute zero. Conventional superconducting refrigerators rely a array of superconductors (S), normal metals (N) and tunnel barriers (I) that are arranged in a symmetric configuration (SINIS or … [Read more...]
New Magnetocaloric Material Could Lead to Greener Refrigerators
The recent discovery of a new magnetocaloric material with intriguing characteristics could lead to a greener method of cooling, potentially providing a more environmentally-friendly alternative to standard refrigeration. A joint team of researchers from Canada and Bulgaria have developed a new method of green cooling by identifying a multiferroic compound, HoMn2O5, that could … [Read more...]
Advances in Vapor Compression Electronics Cooling
INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices. As this energy density has gone up, so has the heat dissipation on electronics packages. In response to this challenge, significant research has taken place to develop chip level cooling systems to meet heat fluxes in excess of 1000W/cm2. As stated … [Read more...]
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