Introduction More than twenty-five years ago, Tuckerman and Pease first described the use of silicon microchannel cooling for very high power densities [1]. However, the coolers could not be fabricated easily and pressure drops were very high. As chip power densities are now increasing beyond air cooling limits, a variety of liquid cooling methods are being investigated. Due to … [Read more...]
Thermal Strain In Semiconductor Packages, Part I
Introduction Silicon became the semiconductor of choice for ICs because of its electrical properties, not because of its mechanical properties. In the earliest days of ICs when chips were small and power levels were low, the mechanical properties of silicon were of little consequence. However, for some time, the opposite situation has been the norm. Now, there are much larger … [Read more...]
Thermal Challenges In LED Cooling
Introduction During the last ten years, developments in LED semiconductors have led to an important change in LED applications from that of luminous indicator to that of illuminator. With LEDs now advancing into several lighting fields, LEDs have become one of the standard methods of producing light, joining more traditional sources such as incandescent, fluorescent and … [Read more...]
Toward A Thermal Figure Of Merit For Multi-Chip Packages
Toward A Thermal Figure Of Merit For Multi-Chip Packages Bruce M. Guenin, Ph.D., Associate Editor Introduction Last issue's Calculation Corner dealt with methods for predicting the temperature of each chip in a Multi-Chip Package (MCP) at an arbitrary combination of chip power levels using the principle of superposition [1]. One of the main points of that article was that both … [Read more...]
Cooling Options And Challenges Of High Power Semiconductor Modules
Introduction Trends in power electronics systems and devices over the last decade have placed increasing demands on the efficiencies of the thermal management systems used for power Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and Insulated Gate Bipolar Transistor (IGBT) modules. The pressure to decrease the size of power electronics systems and, subsequently, the … [Read more...]
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