Did you miss us? For those of you that are faithful readers of Electronics Cooling, we are pleased to inform you that after a short interval of restructuring, we have resumed publication. Given the recent downturn in the economy as a whole, and specifically within the electronics thermal management community, we can hope that this is a sign of improvement and recovery. We will … [Read more...]
IC Package Thermal Characterization Made Easy
FloTHERM® IC is a new Web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Developed with the needs of design engineers and thermal specialists alike, FloTHERM IC offers the ease-of-use of Smartpart technology combined with the power of FloTHERM to greatly boost productivity … [Read more...]
THERMINATOR Project Warms Efforts to Cool Semiconductor Design Solutions
The partners in a new EU-funded research project recently announced details of the multinational/multidisciplinary program: “THERMINATOR: Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future.” This three-year project is designed to maintain the strong positions that Europe’s semiconductor and electronics equipment companies have achieved in … [Read more...]
Solution for Semiconductor Package Thermal Design
Mentor Graphics Corporation has announced the FloTHERM IC productivity tool targeting the semiconductor industry for thermal characterization and design. Addressing increased complexity, chip density, and high-speed requirements for today’s silicon designs, the FloTHERM IC solution is deployed as a unique web-based platform that delivers a high level of automation to the design … [Read more...]
Numerical Simulation of Complex Submicron Devices
Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to the feature size, power densities, and material properties. In semiconductor devices, higher heat flux densities can result from … [Read more...]
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