Convection air cooling is still the most commonly used method of coolingmicroelectronics. In order to deliver air cooled computer equipment with higherreliability, we need to focus on the life expectancy of the air moving devices(AMDs). However, this is not a trivial exercise because there are so manyvariables and there is no industry standard for AMD life test procedures. … [Read more...]
Minimizing acoustical noise in electronic systems
Introduction Air-moving devices (AMDs), such as fans and blowers used for cooling inelectronic systems invariably generate acoustical noise which must be consideredif people are exposed to the emitted noise. In this article, we discussquantitative measures for the description of noise, design guidelines for theselection of low noise air movers, upper limits for the noise … [Read more...]
Thermoelectric thermal regulation systems
Thermoelectric temperature control systems are being used in an increasingnumber of applications. Typical applications of these systems are in thermalregulation of electronic enclosures, recirculating chillers for laser cooling,semiconductor process control and management of patient hypo- and hyperthermia. Thermoelectric coolers (TECs) are essentially solid state devices that … [Read more...]
Applying computational fluid dynamics to heat sink design and selection
Abstract This article describes how Computational Fluid Dynamics (CFD) can help inthe selection and/or design of a heat sink for electronics cooling applications.CFD modeling complements the other tools in the thermal tool kit: calculationsbased on approximations and correlations; and experimental work. Whether theapplication includes single or multiple heat sinks, the … [Read more...]
DELPHI – A status report on the European -union funded project for the creation and validation of thermal models on electronic parts
The accurate prediction of the operating temperatures of critical electronicparts at the component-, board- and system-level is seriously hampered by thelack of reliable, standardised input data. The DELPHI project is addressing thisproblem by the development and experimental validation of thermal models of avariety of `generic' electronic parts. DELPHI (which stands for … [Read more...]
