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the June 2013 issue
of Electronics Cooling, which includes feature articles on Thermal Spreading and More Using Open-Source FEA Software; Two-Phase Flow Control of On-Chip Two-Phase Cooling Systems Developed for Blade Servers of Data Centers, and more.
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Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow Budgets

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Two different package styles, two very different thermal responses when a extruded plate fin heatsink is placed on each. At the very least a FloTHERM simulation can be used to observe the thermal behaviour of…read more