‘Advanced Composite Thermal Management Materials and Applications’ Webinar to Take Place
Electronics Cooling will host its next webinar, “Advanced Composite Thermal Management Materials and Applications” on June 26, 2013. Abstract Thermal management is a key problem for aerospace/defense, commercial and consumer electronic and photonic (e.g. laser…read more
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the June 2013 issue
of Electronics Cooling, which includes feature articles on Thermal Spreading and More Using Open-Source FEA Software; Two-Phase Flow Control of On-Chip Two-Phase Cooling Systems Developed for Blade Servers of Data Centers, and more.
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CFD Software
- Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow BudgetsMay 15th, 2013
- Why Not Just Shove a Heatsink on Top of it? Part 1May 13th, 2013
- Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration MethodologyApril 19th, 2013
- Experiment vs. Simulation, Part 4: Compact Thermal ModelsApril 8th, 2013
Data Centers
- Data Center Liquid Cooling Process Wins Energy Efficiency AwardJune 10th, 2013
- Environmental Regulations and Cloud Computing to Affect Asia-Pacific Data Center Cooling MarketJune 6th, 2013
- Quiet CPU Coolers for Intel Xeon Workstations and ServersMay 17th, 2013
- Two-Phase Flow Control of On-Chip Two-Phase Cooling Systems Developed for Blade Servers of Data CentersMay 16th, 2013
LED / Lighting
- DuPont Increases Thermal Substrate Production to Accommodate DemandJune 7th, 2013
- Dispensable Thermal Pads for Thermal Management in LED Lighting ApplicationsMay 13th, 2013
- Joint Venture for Development of “Next Generation” EV and LED Thermal Management Systems AnnouncedApril 19th, 2013
- Nanocrystal Arrays May Provide Energy Efficient, Low Cost Replacement for Single-Crystal SemiconductorsMarch 22nd, 2013
Liquid Cooling
- Data Center Liquid Cooling Process Wins Energy Efficiency AwardJune 10th, 2013
- World’s First Liquid-Cooled Smartphone ReleasedMay 28th, 2013
- Two-Phase Evaporative Liquid Cooling Systems for Renewable Energy Power Conversion SystemsMay 23rd, 2013
- Thermal Facts and Fairy Tales: A System Perspective for Electronics CoolingMay 16th, 2013
TECs
- “Transverse” Thermoelectric Effect May Lead to Better Cooling DevicesJune 10th, 2013
- Estimating Internal Air Cooling Temperature Reduction in a Closed Box Utilizing Thermoelectrically Enhanced Heat RejectionMay 17th, 2013
- Temperature Controller for Thermoelectric Modules and Supplemental Resistive HeatersMay 17th, 2013
- Programmable Digital Temperature Control for Electronic EnclosuresMay 17th, 2013
TIMs
- Two Thermally Conductive Compounds Added to TIM Product LineJune 7th, 2013
- PCIM Europe Presentation on Solder TIMs for Power Electronics Thermal ManagementMay 13th, 2013
- Thermal Characterization Tools for Testing and Evaluation of TIM MaterialsApril 22nd, 2013
- IBM Awarded Contract in First Phase of DARPA ICECool ProgramApril 19th, 2013
More
- Not Needing to Adjust Hot-Wire Anemometer Reading for Elevated Temperatures. Why Not?June 10th, 2013
- ‘Normalized Transient Thermal Response’ Curves – Can You be More Clear?June 10th, 2013
- I Thought Power Density (W/sq.mm) Went up at the rate of Moore’s Law? Are You Saying it Doesn’t?June 10th, 2013
- PMIC Helps Reduce Thermal Stress of Smartphone and Tablet ProcessorsJune 10th, 2013
News and Events
- Effectively Leveraging CAD Data in Electronics Thermal Simulation
- Beware… When Cooling Practices Fail! Webinar Part II
- World Congress on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics
- Effectively Leveraging CAD Data in Electronics Thermal Simulation
- Beware… When Cooling Practices Fail! Webinar Part I
Featured Blog More Blogs »
Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow Budgets
Two different package styles, two very different thermal responses when a extruded plate fin heatsink is placed on each. At the very least a FloTHERM simulation can be used to observe the thermal behaviour of…read more
