New Super-Cooling Technique Brings Quantum Computing Closer to Reality
Scientists at the University of California Los Angeles have developed a new technique for super-cooling molecules by combining two traditional atomic cooling technologies that may prove to be a breakthrough for quantum computing. According to…read more
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the June 2013 issue
of Electronics Cooling, which includes feature articles on Thermal Spreading and More Using Open-Source FEA Software; Two-Phase Flow Control of On-Chip Two-Phase Cooling Systems Developed for Blade Servers of Data Centers, and more.
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Blowers / Fans / Filters
- Fans for Low-Noise, Low-Airflow ApplicationsMay 17th, 2013
- Ball Bearing for Cooling Fan Motors Handles High-Speed Motor OperationApril 8th, 2013
- Heat Sink with Embedded Fan Suitable for Low-Profile ApplicationsMarch 25th, 2013
- High Speed Vaneaxial Fan for Avionics, Semiconductor, Environmental Control and Heat Exchanger ApplicationsMarch 25th, 2013
CFD Software
- Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow BudgetsMay 15th, 2013
- Why Not Just Shove a Heatsink on Top of it? Part 1May 13th, 2013
- Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration MethodologyApril 19th, 2013
- Experiment vs. Simulation, Part 4: Compact Thermal ModelsApril 8th, 2013
Data Centers
- Quiet CPU Coolers for Intel Xeon Workstations and ServersMay 17th, 2013
- Two-Phase Flow Control of On-Chip Two-Phase Cooling Systems Developed for Blade Servers of Data CentersMay 16th, 2013
- Electronic Performance Impact of Elevated Humidity Environments — Implications for Free Air Cooling of Data CentersMay 16th, 2013
- Liquid Cooling Option for Small and Medium Size IT InstallationsMay 13th, 2013
Heat Sinks
- New Finned Ceramic Heat Sinks ReleasedMay 23rd, 2013
- New Patent-Pending Heat Sink Mounting SystemMay 13th, 2013
- New Customizable Heat Sinks for Use in High Power Environments and ResistorsMarch 11th, 2013
- Board-Level Heat Sinks for Semiconductor Devices in D2Pak, SOT-32, TO-220, and TO-263 PackagesJanuary 21st, 2013
LED / Lighting
- Dispensable Thermal Pads for Thermal Management in LED Lighting ApplicationsMay 13th, 2013
- Joint Venture for Development of “Next Generation” EV and LED Thermal Management Systems AnnouncedApril 19th, 2013
- Nanocrystal Arrays May Provide Energy Efficient, Low Cost Replacement for Single-Crystal SemiconductorsMarch 22nd, 2013
- Thermal Facts & Fairy Tales: Are Critical Heat Fluxes of LEDs and ICs Comparable?March 8th, 2013
Liquid Cooling
- Two-Phase Evaporative Liquid Cooling Systems for Renewable Energy Power Conversion SystemsMay 23rd, 2013
- Thermal Facts and Fairy Tales: A System Perspective for Electronics CoolingMay 16th, 2013
- Liquid Cooling Option for Small and Medium Size IT InstallationsMay 13th, 2013
- Astronauts Fix Ammonia Coolant Leak on International Space StationMay 10th, 2013
TECs
- Estimating Internal Air Cooling Temperature Reduction in a Closed Box Utilizing Thermoelectrically Enhanced Heat RejectionMay 17th, 2013
- Temperature Controller for Thermoelectric Modules and Supplemental Resistive HeatersMay 17th, 2013
- Programmable Digital Temperature Control for Electronic EnclosuresMay 17th, 2013
- Thermal Facts and Fairy Tales: A System Perspective for Electronics CoolingMay 16th, 2013
TIMs
- PCIM Europe Presentation on Solder TIMs for Power Electronics Thermal ManagementMay 13th, 2013
- Thermal Characterization Tools for Testing and Evaluation of TIM MaterialsApril 22nd, 2013
- IBM Awarded Contract in First Phase of DARPA ICECool ProgramApril 19th, 2013
- Report Examines Trends in the Global TIM Materials MarketApril 19th, 2013
News and Events
Featured Blog More Blogs »
Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow Budgets
Two different package styles, two very different thermal responses when a extruded plate fin heatsink is placed on each. At the very least a FloTHERM simulation can be used to observe the thermal behaviour of…read more
