Data Centers

IC Coolers for Limited-Space Requirements

August 11th, 2016

Jaro’s new IC Coolers are ideal for limited-space requirements and designed with BGA, graphic, embedded processors and other IC packages in mind. They are intended for PCMCIA, PCI express cards, blade servers, and all hot…read more

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Of Deepmind, DCIM, and Data Center Cooling

August 10th, 2016

by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online   By now the tech community, especially the readers of Electronics Cooling, is familiar with Google’s Deepmind blog which published a true breakthrough…read more

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Google Uses AI to Control Cooling in Data Centers

July 26th, 2016

(July 20, 2016) Google has been using its newly acquired AI technology from DeepMind to reduce the amount of energy its data centers have been consuming. “The AI technology is applied to the management of…read more

Posted in Blowers / Fans / Filters, Computer, Data Centers, News, Software/Modeling | Comments Off on Google Uses AI to Control Cooling in Data Centers

The Hidden Risk of Invisible Airflow Imbalance in an Efficient Contained Data Center

July 7th, 2016

Husam Alissa, Kourosh Nemati, Dr. Bahgat Sammakia, Mark Seymour, Ken Schneebeli, Dr. Demetriou New Solutions, New Challenges Generally, a legacy data center consists of an array of hot and cold aisles where the air intake…read more

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Liquid Cooled Data Center with More Power and No Leakage

July 5th, 2016

(June 29, 2016) Recently, eBay, Dell, and Intel claimed to have made “major strides in channeling the potential of liquid cooling” to enable greater processing power without excessive consumption “that could have implications for the…read more

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Portable Air Conditioning Are Temporary Saviors for Data Centers

June 28th, 2016

(June 27, 2016) In case of a loss of power, mechanical failure, or planned maintenance, portable air conditioning might be an efficient solution to cool data centers’ electronics. According to ACHRNews.com, contractors and data center…read more

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Laser Storage in Data Centers Could Mean Less Heating

June 7th, 2016

(June 3, 2016) Davide Bossini from the University of Tokyo has found a possible solution to control the demand for smaller, faster, devices to store, manage, and process data in data centers without compromising cooling.…read more

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Custom Liquid Cooling System for Data Centers

June 7th, 2016

(June 2, 2016) “A special unit within Dell that makes custom tech for operators of the world’s largest data centers, has designed a water-based system for cooling custom server chips it developed” for eBay with…read more

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Researchers May Have Solved the Problem of Thermal Resistance for ICs

May 23rd, 2016

(May 18, 2016) Researchers at Lockheed Martin are further exploring the idea of microspraying hot integrated circuits (ICs) to cool their thermal resistance problem. EETimes.com reported, “The efforts are focused on gallium-nitride (GaN) power amplifiers…read more

Posted in Communications, Computer, Coolers, Data Centers, Defense, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, News | Comments Off on Researchers May Have Solved the Problem of Thermal Resistance for ICs

New Skived-Copper Fan Heat-sink Keeps Intel Servers Cool

May 18th, 2016

JARO has recently released their new low-profile, 1U CPU cooler with a heat-sink and blower, model JCC00066. Specifically designed for use with data storage, high-density, backup, or cloud servers, JARO’s cooler works well for Intel processors…read more

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New USB Type-C Connectors and Cable Assemblies

May 2nd, 2016

Heilind Electronics has recently added Molex USB Type-C shielded I/O connectors and cable assemblies to its stock. The Type-C connectors offer a “more compact design” with “greater PCB savings, while allowing high-frequency mating in data,…read more

Posted in Automotive, Consumer, Data Centers, Industrial, New Products, Power | Comments Off on New USB Type-C Connectors and Cable Assemblies

Graphene Nanoflakes Better Dissipates Electronics’ Heat

May 2nd, 2016

(April 29, 2016) Recently, a team of researchers from Chalmers University of Technology in Sweden have developed a more efficient approach to cooling electronics using graphene nanoflake-based film. According to E&T, the team performed “experiments…read more

Posted in Aerospace, Automotive, Computer, Data Centers, Defense, Heat Exchanger, Industrial, IT Products, Materials, Compounds, Adhesives, Substrates, Medical, News, Research, Test & Measurement, TIMs | Comments Off on Graphene Nanoflakes Better Dissipates Electronics’ Heat

New Website for Unique Product Line

April 18th, 2016

Developer of cooling solutions for high-powered electronics, QuantaCool,  has selected Schubert b2b to design a new website to support the company as it goes to market with its PolarBox™, PolarRak™ and PolarMax™ product lines. “QuantaCool’s…read more

Posted in Computer, Data Centers, Heat Pipes, LED / Lighting, New Products, Refrigeration | Comments Off on New Website for Unique Product Line

Company Doubles Compute Capacity within Existing Racks with Liquid Cooling Upgrade

March 29th, 2016

Cascade Technologies is deploying direct contact liquid cooling from CoolIT Systems to increase their compute density by 2.5 times within their existing floor space, rack space and air conditioning capacity. “The upgraded Cascade cluster now…read more

Posted in Computer, Data Centers, Design, Heat Exchanger, Liquid Cooling, New Products | Comments Off on Company Doubles Compute Capacity within Existing Racks with Liquid Cooling Upgrade