Data Centers

Researchers May Have Solved the Problem of Thermal Resistance for ICs

May 23rd, 2016

(May 18, 2016) Researchers at Lockheed Martin are further exploring the idea of microspraying hot integrated circuits (ICs) to cool their thermal resistance problem. EETimes.com reported, “The efforts are focused on gallium-nitride (GaN) power amplifiers…read more

Posted in Communications, Computer, Coolers, Data Centers, Defense, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, News | Comments Off on Researchers May Have Solved the Problem of Thermal Resistance for ICs

New Skived-Copper Fan Heat-sink Keeps Intel Servers Cool

May 18th, 2016

JARO has recently released their new low-profile, 1U CPU cooler with a heat-sink and blower, model JCC00066. Specifically designed for use with data storage, high-density, backup, or cloud servers, JARO’s cooler works well for Intel processors…read more

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New USB Type-C Connectors and Cable Assemblies

May 2nd, 2016

Heilind Electronics has recently added Molex USB Type-C shielded I/O connectors and cable assemblies to its stock. The Type-C connectors offer a “more compact design” with “greater PCB savings, while allowing high-frequency mating in data,…read more

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Graphene Nanoflakes Better Dissipates Electronics’ Heat

May 2nd, 2016

(April 29, 2016) Recently, a team of researchers from Chalmers University of Technology in Sweden have developed a more efficient approach to cooling electronics using graphene nanoflake-based film. According to E&T, the team performed “experiments…read more

Posted in Aerospace, Automotive, Computer, Data Centers, Defense, Heat Exchanger, Industrial, IT Products, Materials, Compounds, Adhesives, Substrates, Medical, News, Research, Test & Measurement, TIMs | Comments Off on Graphene Nanoflakes Better Dissipates Electronics’ Heat

New Website for Unique Product Line

April 18th, 2016

Developer of cooling solutions for high-powered electronics, QuantaCool,  has selected Schubert b2b to design a new website to support the company as it goes to market with its PolarBox™, PolarRak™ and PolarMax™ product lines. “QuantaCool’s…read more

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Company Doubles Compute Capacity within Existing Racks with Liquid Cooling Upgrade

March 29th, 2016

Cascade Technologies is deploying direct contact liquid cooling from CoolIT Systems to increase their compute density by 2.5 times within their existing floor space, rack space and air conditioning capacity. “The upgraded Cascade cluster now…read more

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New Refrigerant-Based Rack and Row Cooling Solution for IT Equipment

March 21st, 2016

Rittal Corporation has recently introduced a new refrigerant-based rack and row cooling solution, LCP DX, for heat removal of critical IT components. The Rittal Rack LCP DX “puts the cooling only where needed to protect…read more

Posted in Blowers / Fans / Filters, Coolers, Data Centers, Heat Exchanger, IT Products, New Products, Refrigeration | Comments Off on New Refrigerant-Based Rack and Row Cooling Solution for IT Equipment

Revolutionary Structure Design Aids in Data Center Cooling

March 17th, 2016

DAMAC, the leading U.S. manufacturer of data center infrastructure equipment, recently unveiled its DAMAC Structure during the Data Center World Global conference in Las Vegas. The structure incorporates an Aisle Containment System, which “encapsulates the…read more

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Higher Temperature Rated MLC Capacitors Announced

March 1st, 2016

Knowles brand, Dielectric Laboratories (DLI), has taken temperature performance to a level of 175°C in their Ultra-low ESR and High Q MLC capacitors. DLI detailed the following: “UL is an EIA Class I Stable TC,…read more

Posted in Aerospace, Automotive, Ceramics, Computer, Consumer, Data Centers, Defense, Design, Industrial, Medical, New Products | Comments Off on Higher Temperature Rated MLC Capacitors Announced

New Liquid Cooled HPC Cluster Launched

February 8th, 2016

CoolIT Systems has successfully completed the second deployment of its Rack DCLC™ liquid cooling solution at the Poznan Supercomputing and Networking Center (PSNC) in partnership with Huawei. The liquid cooled solution is part of the HPC…read more

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Nominations Open for IEEE ITherm Achievement Award

February 8th, 2016

The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research…read more

Underwater Data Center Test Proves Successful

February 1st, 2016

Microsoft, who manages more than 100 data centers around the world, has completed testing of a self-contained data center prototype that can operate hundreds of feet below the surface of the ocean. The New York…read more

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New Higher-Speed Interface for Thermographic Camera

January 25th, 2016

InfraTech has recently released its new 10 Gigabit Ethernet interface for their ImageIR® thermographic camera series. The 10 Gigabit Ethernet interface has “high-speed imaging allowing microsecond exposure times that freeze the apparent motion of dynamic events,”…read more

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“Breakthrough Products of the Year” Award Winner

January 18th, 2016

Enclosure manufacturer, Rittal Corporation, has won Processing magazine’s 2015 Breakthrough Products of the Year award for their Blue e+ Cooling Unit Series for enclosures. “The award recognizes products, technologies and services that have made significant contributions…read more

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