New Products

New Gap Filler Improves Heat Management in Automotive Electronics

May 20th, 2015

Dow Corning introduces the TC-4525, a thermally conductive gap filler that offers advanced heat management in automotive electronics. This gap filler is two-part silicone, soft, compressible and cost-effective. It can be used directly from its…read more

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New Hot Melt Adhesive Offers Instant Green Strength

May 11th, 2015

Dow Corning announces a new hot melt room-temperature vulcanization (RTV) black adhesive, the EA-4600. It’s a one-component, moisture-cure and solventless silicon material, designed to improve assembly of consumer electronics and other devices such as smart…read more

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High Static Pressure Fan Offers 1.4 Times Static Pressure

May 11th, 2015

Sanyo Denki introduces its new San Ace 40 9HV type high static pressure fan. The fan type offers the highest static pressure in the industry – 1.4 times the static pressure than conventional DC fans,…read more

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New Centrifugal Fan Offers High Cooling Performance

May 4th, 2015

Sanyo Denki has launched its new San Ace C225 ø225 mm x 99 mm centrifugal fan. The fan offers industry leading airflow, static pressure, noise and energy efficiency performance, according to the company. Features of…read more

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Frameless Bracket Fans Offer Design Flexibility

May 4th, 2015

JARO Thermal introduces new fluid bearing, frameless, bracket fans that offer airflow from 3.5 CFM to over 51 CFM. These fans offer numerous mounting options and advanced design flexibility. The fans offer an operating temperature…read more

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Programmable Temperature Controller Introduced for Thermoelectric Assemblies

May 4th, 2015

Laird introduces a new SR-54 Series bi-directional programmable controller for Thermoelectric Assemblies (TEAs). The controller monitors and protects important equipment and ensures high performance. The controller is easy to use, customizable, and is ideal for…read more

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Thermal Simulation Software Named Product of the Year

April 24th, 2015

Future Facilities’ thermal simulation software, the 6SigmaET R9, has been chosen as product of the year at the Engineering Simulation Show 2015. Judges awarded the prize for the software being “easy to use, powerful and intuitive”…read more

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Free Giveaway for Naming TIM or Connector Products

April 24th, 2015

Fujipoly is hosting a gift giveaway. On June 5, an engineer will win his/her choice of a free Samsung Galaxy Tab Pro, Apple iPhone 6, or a $500 American Express Giftcard, in Fujipoly America Corporation’s…read more

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Thermal Foil Sheets Offer Advanced Thermal Management in Smartphones

April 13th, 2015

Angstron Materials Inc. has developed a family of thermal foil products ideal for smartphones, and other hand-held devices. The new thermal foil sheets have a thickness of from 5 um to 40 um and thermal…read more

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Thermoelectric Coolers Ideal for Cooling Mobile Devices in All Environments

April 13th, 2015

EIC Solutions Inc. introduces a product line of Auto-ranging (M105) Thermoelectric Air Conditioners. The ThermoTEC 141, 145 and 151 series have auto ranging power capabilities. The auto ranging feature is ideal for cooling mobile devices…read more

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Low Cost Louvered Fan Guards Introduced

April 6th, 2015

Orion Fans expands its fan accessories to include the lowest-cost louvered fan guards in the industry. The fan guards are ideal for use in 80, 92, 120, 172, 225, 254 and 280mm AC fans. Fan…read more

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Temporary Bonding Adhesive for 3D Wafer Integration

April 6th, 2015

AI Technology Inc. introduces its new 3D TSV ultra thin wafer processing adhesive (WPA) for thin wafer processing. The new adhesives are thermally stable to 320-330 degrees Celsius and have high bond strength. “In comparison…read more

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Clear Encapsulant Ideal for Outdoor LED Lighting Applications

March 23rd, 2015

Dow Corning introduces a new clear and reliable Encapsulant for harsh outdoor LED lighting applications. The EI-1184 Silicone Encapsulant features high transparency, high weatherability, long lasting protection in harsh outdoor and indoor environments, and protection…read more

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New Thermal Interface Material Introduced

March 23rd, 2015

Fujipoly America Corporation introduces the Sarcon SG-26SL, a new thermal interface material. The Sarcon SG-26SL is easy to apply, thermally conductive, silicone-based, and electrically non-conductive. This TIM offers thermal conductivity of 2.6 W/m°K, an operation…read more

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