New Products

New Speed Controllers for Fans to Reduce Energy Consumption

May 23rd, 2016

Orion Fans has recently developed a low-cost dual channel phase control unit to control fan speed for single or multiple fan assemblies, series OA11/22. It is field adjustable, with the ability to precisely control fan noise,…read more

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Thermoelectric Modules That Achieve Higher Heat Flux Densities For Cooling Industrial Lasers

May 23rd, 2016

Laird has recently developed a high heat flux density thermoelectric module (TEM) designed to achieve a higher heat pumping capacity than standard TEMs, called UltraTEC. “The UltraTEC Series TEM has a heat pumping capacity up…read more

Posted in Coolers, Design, Industrial, New Products, Semiconductor, TECs | Comments Off on Thermoelectric Modules That Achieve Higher Heat Flux Densities For Cooling Industrial Lasers

Thermal Simulation Tool for Design Engineers Available

May 23rd, 2016

In recent years, Cradle has created and launched an easy to use, real-time, printed circuit board thermal analysis tool for electrical designers, called the Cradle PICLS. PICLS enables electrical designers to instantly evaluate how changes…read more

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Thin “Super-Flow Micro” Fan Offers 0.60cfm

May 18th, 2016

JARO has recently released their newest Micro-Fan available with 0.60cfm. The fan measures 17x17x4 mm (at 15,000rpm), and offers a static pressure  of 2.413 mm H2O, according to JARO. With operating voltages from 2.8 to…read more

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New Skived-Copper Fan Heat-sink Keeps Intel Servers Cool

May 18th, 2016

JARO has recently released their new low-profile, 1U CPU cooler with a heat-sink and blower, model JCC00066. Specifically designed for use with data storage, high-density, backup, or cloud servers, JARO’s cooler works well for Intel processors…read more

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New Availability of Data Matrix Codes (DMCs)

May 9th, 2016

Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by…read more

Posted in Aerospace, Automotive, Communications, Computer, Defense, Industrial, Materials, Compounds, Adhesives, Substrates, Medical, New Products | Comments Off on New Availability of Data Matrix Codes (DMCs)

New USB Type-C Connectors and Cable Assemblies

May 2nd, 2016

Heilind Electronics has recently added Molex USB Type-C shielded I/O connectors and cable assemblies to its stock. The Type-C connectors offer a “more compact design” with “greater PCB savings, while allowing high-frequency mating in data,…read more

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Industry’s First Portable Measurement Equipment to Improve Thermal Efficiency

May 2nd, 2016

SANYO DENKI has recently developed and launched the first portable measuring equipment that measures the system impedance and operating airflow of devices. The San Ace Airflow Tester claims to “improve the thermal efficiency of a…read more

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New “Form-In-Place” Product with Process Demonstration Video

April 22nd, 2016

JONES TECH recently released their newest “Form-In-Place” Product with a video that demonstrates their FIP process. Their thermal product offerings include thermal pads, thermal greases, thermal gels, phase change materials, and synthetic graphite. Jones Tech…read more

Posted in Computer, Design, Design, Materials, Compounds, Adhesives, Substrates, New Products, Thermal Imaging | Comments Off on New “Form-In-Place” Product with Process Demonstration Video

New Website for Unique Product Line

April 18th, 2016

Developer of cooling solutions for high-powered electronics, QuantaCool,  has selected Schubert b2b to design a new website to support the company as it goes to market with its PolarBox™, PolarRak™ and PolarMax™ product lines. “QuantaCool’s…read more

Posted in Computer, Data Centers, Heat Pipes, LED / Lighting, New Products, Refrigeration | Comments Off on New Website for Unique Product Line

New System Improves Lead Times

April 18th, 2016

A manufacturer of thermoelectric air conditioners, TECA Corporation, has recently implemented a new program to improve lead times. President of TECA, Mike Mikalauskis, said, “We were able to pair new software with a more streamlined…read more

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New Market Entry of Sealed Enclosure Coolers

April 11th, 2016

As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their…read more

Posted in Communications, Consumer, Coolers, Defense, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Medical, New Products | Comments Off on New Market Entry of Sealed Enclosure Coolers

New Coolers for Laser Diodes Released

March 29th, 2016

Recently Rogers Corporation’s Power Electronics Solutions (PES) group has released its new curamik CoolPerformance Plus coolers. Roger’s said that “curamik CoolPerformance Plus is an advanced liquid-cooled material designed to dissipate large amounts of heat and…read more

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Company Doubles Compute Capacity within Existing Racks with Liquid Cooling Upgrade

March 29th, 2016

Cascade Technologies is deploying direct contact liquid cooling from CoolIT Systems to increase their compute density by 2.5 times within their existing floor space, rack space and air conditioning capacity. “The upgraded Cascade cluster now…read more

Posted in Computer, Data Centers, Design, Heat Exchanger, Liquid Cooling, New Products | Comments Off on Company Doubles Compute Capacity within Existing Racks with Liquid Cooling Upgrade