New Products

Epoxy Meets UL94V-0 Specifications

May 15th, 2013

Master Bond released a new epoxy, EP21FRNS-2, which passed UL 94V-0 testing for “flame retardancy in potting, encapsulation and casting applications.” The EP21FRNS-2 is color-coded for simplicity, “features a non-halogen filler,” and “is a reliable…read more

New PWM Version of Fan Released

May 15th, 2013

Noctua has released a “performance-oriented” PWM version of the NF-A14 140 mm fan. Previously, only the NF-A15 round-frame model was available with PWM support for automatic speed control. The NF-A14 “complies with Noctua’s Advanced Acoustic…read more

Revisions for CPU Coolers for Intel Xeon

May 15th, 2013

Noctua, a maker of cooling components, has released revisions of its NH-U12DX and NH-U9DX for Intel Xeon workstations and servers. These new i4 models support LGA2011, LGA 1356 and LGA2011 and also come with “PWM…read more

High Powered Temperature Controller Released

May 15th, 2013

Oven Industries, suppliers of custom temperature controllers and sensors, has released a new high powered temperature controller that can be used on a heat sink, allowing for a “seamless transition between heating and cooling devices.”…read more

New Patent-Pending Heat Sink Mounting System

May 13th, 2013

Penn Engineering has released the new patent-pending PEM heat sink mounting system for secure attachment of heat sinks to circuit boards. According to the company, the new heat sink mounting system consists of “Type HSCB…read more

Embedded Heat Pipe Technology for Heat Removal in Military Applications

May 13th, 2013

Researchers at Advanced Cooling Technologies Inc. have developed a new cooling technique for high-power VPX embedded computing cards that utilizes embedded heat pipes to increase heat removal for computer boards. The new Dual-Sided Condenser technology…read more

Cooling Filters and Venting Products for Range of Telecommunication Applications

May 13th, 2013

Fluoropolymer technology and manufacturing company W.L. Gore & Associates has announced that it will debut its latest venting products and cooling filters for use by the telecommunications industry at the CTIA 2013 Mobile Marketplace in…read more

Dispensable Thermal Pads for Thermal Management in LED Lighting Applications

May 13th, 2013

Dow Corning, a developer of silicone-based technology, has announced new dispensable thermal pads developed for more cost-effective thermal management in LED lighting applications. Dow Corning’s new product line of dispensable thermal pads features four grades…read more

Liquid Cooling Option for Small and Medium Size IT Installations

May 13th, 2013

Rittal Corporation, a manufacturer of industrial enclosures, server racks, power distribution systems and data center cooling products, has released the Liquid Cooling Package Direct Expansion (LCP DX) cooling option. According to the company, the LCP…read more

Thermoreflectance Thermal Imaging System for Quality Control and Reliability Analysis

April 22nd, 2013

Microsanj, LLC, a supplier of high resolution, thermoreflectance thermal imaging systems, tools and services, has announced the availability of a new addition to the Nanotherm series of thermoreflectance thermal imaging products. The NT100A General Purpose…read more

Software Suite Handles Massive Data Flows Generated by Thermal Sensors

April 22nd, 2013

LumaSense Technologies, a developer of temperature and gas sensing devices, has released LumaSpec R/T, a new industrial analytics software for thermography. According to the company, the new software “introduces real sensor graphics process intelligence to…read more

Thermal Characterization Tools for Testing and Evaluation of TIM Materials

April 22nd, 2013

Thermal Engineering Associates, Inc. (TEA) has announced the availability of a new family of thermal interface material characterization tools. According to TEA, the new tools are designed to make the testing and evaluation of TIM…read more

Water Blocks for Cooling Professional Dual-Processor Server and CAE Graphics Cards

April 8th, 2013

Liquid cooling solutions provider EK Water Blocks has announced water cooling solutions for AMD FirePro S10000 series dual-processor server graphics cards and AMD FirePro W9000 series graphics cards for computer-aided engineering (CAE) applications. According to…read more

Ball Bearing for Cooling Fan Motors Handles High-Speed Motor Operation

April 8th, 2013

NSK Ltd., a developer of industrial bearings, automotive bearings and modules and linear motion products, has released a high-performance ball bearing for cooling fan motors used in personal computers, data servers and communication base stations.…read more