New Products

Company Asked to Participate in Three-Year Project

September 22nd, 2014

Element Six has recently been asked by the European Commission’s Seventh Framework Programme to assist in a three year project to develop high power laser on a 3.1 million dollar budget. “The new laser will…read more

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New EP21AOLV-2Med Epoxy Proves Successful and Desirable

September 22nd, 2014

Masterbond Inc. has just introduced its New Epoxy named EP21AOLV-2Med which has passed all USP Class VI Tests and ISO 10993-5 Specifications. “EP21AOLV-2Med is thermally conductive and electrically isolating with a smooth consistency and good…read more

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New Development of Silicon Carbide Substrates Raises the Bar

September 22nd, 2014

Dow Corning, an industry leader in silicon materials, has just introduced it now offers “150 mm diameter silicon carbide (SiC) wafers under its ground-breaking Prime Grade portfolio. Recently launched to set new standards for 100…read more

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Company Announces New SPG-20B

September 22nd, 2014

Fujipoly America Corporation has just announced its silicon product SARCON® SPG-20B – a new version of their previous product, SARCON® SPG-15A. Benefits of the new product include a 40 percent greater thermal conductivity level and…read more

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New Series of Bonding Wax Created to Shrink Wafers in Electronic Devices

September 22nd, 2014

AI Technology, Inc. has just announced its new temporary bonding wax – which was developed with intentions to shrink the thickness of wafers and dies in electronic devices such as cell phones, tablets, cameras, etc.…read more

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Expansion of Company’s Line of Conductive Compounds Expected to Increase Consistency

September 22nd, 2014

RTP company, a company that produces custom thermoplastics, has just announced its new conductive compounds. The expansion of its previous line of conductive compounds is intended to progress levels of consistency in conductivity and mechanical…read more

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Two New Grades of Compound to Reduce Cost and Maintain High Performance

September 19th, 2014

Saudi Basic Industries Corporation (SABIC) has just announced it has expanded its portfolio of compounds and materials by adding two new grades of a compound called KONDUIT. KONDUIT  PX13012 and PX11311U are made of compounds…read more

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Partnership Leads to Success in Development of New Converter

September 19th, 2014

Calyos, a new company that specializes in 2-phase cooling solutions of electronics, has partnered with Alstom Transport to develop a railway converter named the CIPLIX Traction Coffer.  From September 23-26, Calyos will be in Berlin…read more

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Organic Thin-Film Transistors Now Formed through Room-Temperature Printing

September 18th, 2014

Japanese researchers confirmed a new process for developing organic thin-film transistors (TFTs) while at room temperature. This new process uses flexible materials such as plastic – which will aid in the mass production of future…read more

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Organic Thin-Film Transistors Now Formed through Room-Temperature Printing

September 9th, 2014

Japanese researchers confirmed a new process for developing organic thin-film transistors (TFTs) while at room temperature. This new process uses flexible materials such as plastic – which will aid in the mass production of future…read more

New Non-Spill Couplings Ensure Drip-free Operation

September 8th, 2014

Colder Products Company has just increased its NS4 Series couplings to consist of elbow insert configurations, which halts the need to twist and bend tubes in the control boxes. Researchers say these new couplings are…read more

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Material Scientists Celebrate Newly Discovered Process of Turning Metal Into Glass

September 2nd, 2014

A major goal of materials scientists in recent years has been to create glass from pure monoatomic metals. Researchers Scott X. Mao and his colleagues at the University of Pittsburgh have done exactly that, they…read more

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High Performance Thermal Imaging Camera Meets R&D Requirements

August 26th, 2014

FLIR Systems has introduced the FLIR A65sc, a new high performance thermal imaging camera designed for research and design applications. Capable of visualizing temperatures from -40°C to +550°C with temperature differences as small as 50mK,…read more

Cold Forged Heat Sinks Boost Thermal Management of LEDs

August 19th, 2014

GlacialTech Inc. has introduced Igloo FR210 and Igloo FR210HP, two new cold forging thermal modules designed for 80W LED thermal management applications. The Igloo FR210HP differs from the Igloo FR210 in that it optimized for…read more

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