New Products

Small NEMA 12 Cabinet Coolers Resist Heat And Dirt

April 17th, 2014

EXAIR has introduced new small NEMA 12 cabinet cooling systems to keep electrical enclosures cool while resisting heat and dirty environments that could adversely affect the internal components. Featuring a cooling capacity of up to…read more

Thermal Material Provides Both Compressibility and Conformability with Phase-Change Ability

April 17th, 2014

AI Technology, Inc. has released COOL-PAD™ CPR7154, a thermal interface material that dispenses like a thermal pad but exhibits characteristics like that of a grease or gel when device temperatures increase to above 45°C. Ideal…read more

New Thermal Adhesive Boasts Twice the Conductivity at Half the Cost

April 4th, 2014

3M’s Electronics Markets Materials Division (EMMD) has released 3M 8904, a thermally conductive adhesive tape for thermal management and part bonding in electronic devices, as well as general heat dissipation. Containing thermally conductive particles as…read more

High Thermal Conductivity Thin Film

April 3rd, 2014

Fujipoly America has announced Sarcon 30-YR-a Thin Film, a new high performance thermal interface material. Measuring just 0.3mm thick, the Sarcon 30-YR-a thin film exhibits a thermal conductivity of 2.2 W/m°K with a thermal resistance…read more

Liquid Cold Plate Cools Power Electronics

March 27th, 2014

Thermal management company GCoreLab has introduced a new generation of cold plates for the cooling of power electronics. The new XtremeChill liquid cold plate utilizes GCoreLab’s patented oblique fin technology, which offers superior thermal cooling…read more

Thermally Conductive Copper Grease for High-Temp Heat Transfer

March 21st, 2014

Aremco has released Heat-Away 640, a new high temperature, thermally conductive, copper-filled grease for use in heat transfer applications from –60 to 550 ºF (-51 to 288 ºC). Designed to improve the thermal transfer between…read more

Heat Exchangers Cool Electrical and Electronic Enclosures

March 21st, 2014

EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has released its HE series heat exchangers for cooling electrical and electronic enclosures. Ideal for cooling medical devices, food/beverage process controls, telecom…read more

Bergquist Talks TIMs at Semi-Therm 30

March 14th, 2014

Form-in-Place Thermal Compound for Delicate or Low Compression Requirements

March 11th, 2014

Fujipoly has released SARCON SPG-50A, a form-in-place gap filler material with a thermal conductivity of 5.0 W/m°K. Exhibiting ultra-low compression force, the new silicone-based compound is ideal for applications that have delicate components or low…read more

Non-Silicone Thermal Pad Offers Natural Tack, Good Insulation

March 10th, 2014

Tglobal Technology Co., Ltd. has released its new PC94 non-silicone thermally conductive pad. Ideal for electronic component, heat sink, LED and other thermal applications, the new soft pad features an acryl base, natural tack and…read more

TTI Analyzers Offer Low-Cost Solution for Non-Invasive Thermal Design Verification

March 7th, 2014

Microsanj, a supplier of high-resolution thermoreflectance thermal imaging systems, tools and consulting services, has announced the availability of its NT100/NT110 thermoreflectance thermal image analyzers starting at $45,000. The availability of the NT100 sub-micon spatial resolution…read more

Expanded Product Catalog Features New Thermal Interface Materials

March 6th, 2014

Fujipoly has released its new thermal interface material and elastomeric connector product catalog. The 52-page product overview and technical guide includes design guidelines as well as detailed thermal performance and electrical conductivity data points. Several…read more

Thermal Pad Offers Advantages of Thermal Grease Without Mess

March 3rd, 2014

AOS Thermal Compounds has released Micro-Faze, a new thermal interface material formulated with non-silicone thermal grease. Micro-Faze offers a number of technical advantages, including low thermal resistance with minimum force and conformance with coefficient of…read more

Cooling Fans for 1U Rack Applications

February 24th, 2014

Thermal management product designer US Tech has released three new high performance fan series for use in 1U rack applications. The 36mm model produces 24.16 CFM of air volume and 67.52 mm-H2O pressure. In addition,…read more