New Products

Solid-state CPU Cooler Offers Advanced Cooling

August 24th, 2015

Phononic unveils a new solid-state CPU cooler, the Phononic model HEX 1.0. The small package, with dimensions of 4.3″ x 3.5″ x 3.5″, offers an advanced cooling performance despite its tiny size. “Unlike traditional heatsink/fan…read more

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New Adhesives Ideal for Bonding and Encapsulating Semiconductors

August 24th, 2015

DELO introduces new one-component epoxy resins that can withstand temperatures up to 250 degrees Celsius. These new anhydride-based adhesives are ideal for bonding and encapsulating sensors and semiconductors, according to the company. The adhesives were…read more

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TIM with EMI Absorption Capabilities Announced

August 24th, 2015

Henkel introduces the first ever low-stress thermal interface material with EMI absorption capabilities, known as the Gap Pad EMI 1.0. “The latest in its line of BERGQUIST GAP PAD products, Henkel’s GAP PAD EMI 1.0…read more

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Liquid-cooled Primergy Server to Cut Energy Costs in Half

August 12th, 2015

Fujitsu unveiled a new liquid-cooled Primergy server, the Primergy CX400 M1, which will cut energy costs in half and increase density in data centers by five times. “Fujitsu is revolutionizing data center design, and is…read more

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New TIMs for ECUs and Embedded Systems Cooling

August 12th, 2015

Fujipoly America Corporation introduces an assortment of TIMs for commercial and military vehicle ECUs and embedded systems cooling. “The company manufactures its proprietary Sarcon® material in many different forms, thicknesses and shapes to satisfy nearly…read more

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Partnership Forms to Offer New Liquid-cooling Solutions

August 12th, 2015

Mellanox Technologies and Icetope are partnering to offer liquid-cooled InfiniBand and Ethernet network interconnects for high-performance computing. The companies are combining Icetope’s liquid-cooling technology and Mellanox’s knowledge of high performance networks to produce a “36-port…read more

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Three New Lines of TIMs Offer High Thermal Conductivity

August 12th, 2015

Aavid Thermalloy introduces three new lines of high-performance thermal interface materials – thermally conductive gap fillers. The three lines include the SuperThermal™, SoftFlex™, and WaveBlocker™. These product lines offer very high thermal conductivity without compromising…read more

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First Hybrid Temperature Chamber Introduced to Industry

August 10th, 2015

TotalTemp Technologies, Inc. introduces a hybrid benchtop chamber for thermal testing that combines both convection and thermal conduction in one unit. It is the first hybrid temperature chamber on the market. The HBC-SD49 Hybrid Benchtop…read more

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Energy-saving High Airflow and Static Pressure Fan Introduced

August 4th, 2015

Sanyo Denki Co. LTD. launched its new 92 x 92 x 38 mm AC DC fan that offers high airflow and high static pressure – the San Ace 92AD. This fan works by internally converting…read more

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High Performance Epoxy Passes ASTM E595 Testing For NASA Specifications

July 27th, 2015

Master Bond introduces a two-part, NASA approved, low outgassing, high temperature resistant epoxy known as the EP121CL-LO. “This two component system has a low mixed viscosity of 1,000-3,000 cps with a mix ratio of 100:80…read more

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New Fan Offers Industry Leading Static Pressure

July 27th, 2015

Sanyo Denki introduces the San Ace 172 9HV type ø 172 x 150 x 51 mm high static pressure fan. The San Ace 172 9HV type offers industry leading static pressure, or 1.6 times the…read more

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Company Ships 1M Thermal Solution for Medical Devices

July 20th, 2015

Thermacore, Inc., has shipped its one millionth thermal solution for Class II and Class III medical devices from its facility in Lancaster, Pa. “Thermacore is dedicated to supporting the medical industry’s efforts to improve healthcare…read more

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Colored Electrically Conductive Inks and Coatings

July 20th, 2015

Creative Materials, Inc. introduces the 126-29 product series of electrically conductive inks and coatings. The inks and coatings are available in red, blue or yellow. “Colored conductive inks feature good color stability and minimal opportunity…read more

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New Heat Transfer Tapes Offer Advanced Thermal Management

July 14th, 2015

Techsil introduces two new thermally conductive and pressure sensitive adhesive tapes for thermal management of electronic systems, the Stokvis 202331 and 202332. The tapes are double sided and provide efficient cooling solutions by dissipating heat…read more

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