Master Bond released a new epoxy, EP21FRNS-2, which passed UL 94V-0 testing for “flame retardancy in potting, encapsulation and casting applications.” The EP21FRNS-2 is color-coded for simplicity, “features a non-halogen filler,” and “is a reliable…read more
New PWM Version of Fan Released
May 15th, 2013
Noctua has released a “performance-oriented” PWM version of the NF-A14 140 mm fan. Previously, only the NF-A15 round-frame model was available with PWM support for automatic speed control. The NF-A14 “complies with Noctua’s Advanced Acoustic…read more
Revisions for CPU Coolers for Intel Xeon
May 15th, 2013
Noctua, a maker of cooling components, has released revisions of its NH-U12DX and NH-U9DX for Intel Xeon workstations and servers. These new i4 models support LGA2011, LGA 1356 and LGA2011 and also come with “PWM…read more
High Powered Temperature Controller Released
May 15th, 2013
Oven Industries, suppliers of custom temperature controllers and sensors, has released a new high powered temperature controller that can be used on a heat sink, allowing for a “seamless transition between heating and cooling devices.”…read more
New Patent-Pending Heat Sink Mounting System
May 13th, 2013
Penn Engineering has released the new patent-pending PEM heat sink mounting system for secure attachment of heat sinks to circuit boards. According to the company, the new heat sink mounting system consists of “Type HSCB…read more
Embedded Heat Pipe Technology for Heat Removal in Military Applications
May 13th, 2013
Researchers at Advanced Cooling Technologies Inc. have developed a new cooling technique for high-power VPX embedded computing cards that utilizes embedded heat pipes to increase heat removal for computer boards. The new Dual-Sided Condenser technology…read more
Cooling Filters and Venting Products for Range of Telecommunication Applications
May 13th, 2013
Fluoropolymer technology and manufacturing company W.L. Gore & Associates has announced that it will debut its latest venting products and cooling filters for use by the telecommunications industry at the CTIA 2013 Mobile Marketplace in…read more
Dispensable Thermal Pads for Thermal Management in LED Lighting Applications
May 13th, 2013
Dow Corning, a developer of silicone-based technology, has announced new dispensable thermal pads developed for more cost-effective thermal management in LED lighting applications. Dow Corning’s new product line of dispensable thermal pads features four grades…read more
Liquid Cooling Option for Small and Medium Size IT Installations
May 13th, 2013
Rittal Corporation, a manufacturer of industrial enclosures, server racks, power distribution systems and data center cooling products, has released the Liquid Cooling Package Direct Expansion (LCP DX) cooling option. According to the company, the LCP…read more
Thermoreflectance Thermal Imaging System for Quality Control and Reliability Analysis
April 22nd, 2013
Microsanj, LLC, a supplier of high resolution, thermoreflectance thermal imaging systems, tools and services, has announced the availability of a new addition to the Nanotherm series of thermoreflectance thermal imaging products. The NT100A General Purpose…read more
Software Suite Handles Massive Data Flows Generated by Thermal Sensors
April 22nd, 2013
LumaSense Technologies, a developer of temperature and gas sensing devices, has released LumaSpec R/T, a new industrial analytics software for thermography. According to the company, the new software “introduces real sensor graphics process intelligence to…read more
Thermal Characterization Tools for Testing and Evaluation of TIM Materials
April 22nd, 2013
Thermal Engineering Associates, Inc. (TEA) has announced the availability of a new family of thermal interface material characterization tools. According to TEA, the new tools are designed to make the testing and evaluation of TIM…read more
Water Blocks for Cooling Professional Dual-Processor Server and CAE Graphics Cards
April 8th, 2013
Liquid cooling solutions provider EK Water Blocks has announced water cooling solutions for AMD FirePro S10000 series dual-processor server graphics cards and AMD FirePro W9000 series graphics cards for computer-aided engineering (CAE) applications. According to…read more
Ball Bearing for Cooling Fan Motors Handles High-Speed Motor Operation
April 8th, 2013
NSK Ltd., a developer of industrial bearings, automotive bearings and modules and linear motion products, has released a high-performance ball bearing for cooling fan motors used in personal computers, data servers and communication base stations.…read more
Recent Posts
- Thermal Spreading and More Using Open-Source FEA Software
- Two-Phase Flow Control of On-Chip Two-Phase Cooling Systems Developed for Blade Servers of Data Centers
- Thermal Facts and Fairy Tales: A System Perspective for Electronics Cooling
- Electronic Performance Impact of Elevated Humidity Environments — Implications for Free Air Cooling of Data Centers
- Epoxy Meets UL94V-0 Specifications
- Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow Budgets
- New PWM Version of Fan Released
- Revisions for CPU Coolers for Intel Xeon
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