Posts tagged Thermal Modeling

Thermal Modeling and Testing for LEDs and Luminaires

December 22nd, 2011

Mentor Graphics Corp. has introduced the T3Ster (“trister”) thermal transient tester for LEDs, board-level LED arrays and luminaires. Together with the company’s FloTHERM thermal simulation tool based on computational flow dynamics (CFD), lighting designers can…read more

Posted in LED / Lighting, New Products, TECs | Comments Off

Tags: , , , ,

LED Thermal Standardization: A Hot Topic

May 9th, 2009

Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package).…read more

Posted in Aerospace, Applications, Automotive, Communications, Consumer, Defense, Industrial, Industries, IT Products, Medical, Power, Test & Measurement | Comments Off

Tags: , , , , , , , ,

Compact thermal modeling in electronics design

May 1st, 2007

Compact thermal modeling in electronics design Sarang Shidore Flomerics Inc Introduction The challenge of accurately predicting junction temperatures of IC components in system-level CFD simulations has engaged the engineering community for a number of years.…read more

Posted in Design, Test & Measurement | Comments Off

Tags: , , , , ,

A Simple Thermal Resistance Model – Isoflux Versus Isothermal

February 1st, 2006

In most cases today thermal design for electronic products is performed with the aid of sophisticated computational fluid dynamics and heat transfer codes. Nonetheless, there may still be occasions when a thermal designer needs a…read more

Posted in Calculation Corner, Design, Test & Measurement | Comments Off

Tags: , , , ,

Design of Experiments for Numerical Parameter Studies of Electronic Systems: Optimizing the Cooling Strategy of an Ethernet Switch

May 1st, 2005

Introduction As electronic products become more sophisticated and design margins tighten, defining the thermal management strategy early in the design cycle is vital to ensure a cost-effective design for the level of heat dissipation. Optimizing…read more

Posted in Communications, Computer, Design, Test & Measurement | Comments Off

Tags: , ,

Low Profile Heat Sink Cooling Technologies for Next Generation CPU Thermal Designs

February 1st, 2005

Introduction The electronic industry requires increased forced-air cooling limits to cool high-end server CPUs adequately. Improving air-cooled heat sink thermal performance is one of the critical areas for increasing the overall air-cooling limit. One of…read more

Posted in Design, Heat Pipes, Heat Sinks, Test & Measurement | Comments Off

Tags: , , , ,

Entrance Effects For Heat Flow Into A Multi-Layer Printed Circuit Board

November 1st, 2004

Introduction Since their introduction, multilayer printed circuit boards have provided a significant benefit to the thermal management of IC packages. As is widely recognized, the power and ground planes in these boards function as fins…read more

Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | Comments Off

Tags: , , , , ,

Thermal design of fault tolerant and high availability computer systems

September 1st, 1999

Thermal Design is one of the most challenging aspects of computer system design. This is definitely the case when it comes to designing for “fault tolerance” and “high availability” in high-speed multiprocessor-based systems. The inherent…read more

Posted in Computer, Design, Heat Sinks, Semiconductor, Test & Measurement | Comments Off

Tags: , , ,

DELPHI – A status report on the European -union funded project for the creation and validation of thermal models on electronic parts

January 1st, 1996

The accurate prediction of the operating temperatures of critical electronicparts at the component-, board- and system-level is seriously hampered by thelack of reliable, standardised input data. The DELPHI project is addressing thisproblem by the development…read more

Posted in Design, Software/Modeling, Technical Brief, Test & Measurement | Comments Off

Tags: , , , ,