Mentor Graphics Corp. has introduced the T3Ster (“trister”) thermal transient tester for LEDs, board-level LED arrays and luminaires. Together with the company’s FloTHERM thermal simulation tool based on computational flow dynamics (CFD), lighting designers can…read more
Thermal Modeling and Testing for LEDs and Luminaires
December 22nd, 2011
Posted in LED / Lighting, New Products, TECs | No Comments »
LED Thermal Standardization: A Hot Topic
May 9th, 2009
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package).…read more
Posted in Aerospace, Applications, Automotive, Communications, Consumer, Defense, Industrial, Industries, IT Products, Medical, Power, Test & Measurement | No Comments »
Compact thermal modeling in electronics design
May 1st, 2007
Compact thermal modeling in electronics design Sarang Shidore Flomerics Inc Introduction The challenge of accurately predicting junction temperatures of IC components in system-level CFD simulations has engaged the engineering community for a number of years.…read more
Posted in Design, Test & Measurement | No Comments »
A Simple Thermal Resistance Model – Isoflux Versus Isothermal
February 1st, 2006
In most cases today thermal design for electronic products is performed with the aid of sophisticated computational fluid dynamics and heat transfer codes. Nonetheless, there may still be occasions when a thermal designer needs a…read more
Posted in Calculation Corner, Design, Test & Measurement | No Comments »
Design of Experiments for Numerical Parameter Studies of Electronic Systems: Optimizing the Cooling Strategy of an Ethernet Switch
May 1st, 2005
Introduction As electronic products become more sophisticated and design margins tighten, defining the thermal management strategy early in the design cycle is vital to ensure a cost-effective design for the level of heat dissipation. Optimizing…read more
Posted in Communications, Computer, Design, Test & Measurement | No Comments »
Low Profile Heat Sink Cooling Technologies for Next Generation CPU Thermal Designs
February 1st, 2005
Introduction The electronic industry requires increased forced-air cooling limits to cool high-end server CPUs adequately. Improving air-cooled heat sink thermal performance is one of the critical areas for increasing the overall air-cooling limit. One of…read more
Posted in Design, Heat Pipes, Heat Sinks, Test & Measurement | No Comments »
Entrance Effects For Heat Flow Into A Multi-Layer Printed Circuit Board
November 1st, 2004
Introduction Since their introduction, multilayer printed circuit boards have provided a significant benefit to the thermal management of IC packages. As is widely recognized, the power and ground planes in these boards function as fins…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Thermal design of fault tolerant and high availability computer systems
September 1st, 1999
Thermal Design is one of the most challenging aspects of computer system design. This is definitely the case when it comes to designing for “fault tolerance” and “high availability” in high-speed multiprocessor-based systems. The inherent…read more
Posted in Computer, Design, Heat Sinks, Semiconductor, Test & Measurement | No Comments »
DELPHI – A status report on the European -union funded project for the creation and validation of thermal models on electronic parts
January 1st, 1996
The accurate prediction of the operating temperatures of critical electronicparts at the component-, board- and system-level is seriously hampered by thelack of reliable, standardised input data. The DELPHI project is addressing thisproblem by the development…read more
Posted in Design, Software, Technical Brief, Test & Measurement | No Comments »
Recent Posts
- Measured Thermal Resistance of Microbumps in 3D Chip Stacks
- Measuring and Predicting Junction Temperature: Thermal Factors Influencing Reliability in GaN HEMTs
- APEC 2013: Applied Power Electronics Conference and Exhibition
- Acquisition of R.O.C. Fan Design and Manufacturing Company Adds New Blowers and Fans to Global Thermal Management Product Line
- Modular Cooling System Designed for Rapid Deployment with Containerized Data Centers
- Modular Aisle Containment Solution Separates Hot and Cold Airflows in Energy-Efficient Manner
- New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
- New Customizable Heat Sinks for Use in High Power Environments and Resistors
Latest Issue
Don’t miss out on
the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
View Issue »
Popular Posts
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Seebeck Coefficient 3 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Notes on Using Thermocouples 9 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 9 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
