Component reliability testing can lead to an inherent disagreement in what different people hope to see from the results. Designers who want to use the components hope that no components fail during qualification testing to verify that they meet the reliability requirement. In contrast, analysts who characterize the reliability of the components need a sufficient number of … [Read more...]
Engineering Leak-Free Performance for Mission-Critical Electronics
Chips are getting hotter, and liquid cooling is moving from niche to necessary. That transition changes what “good” looks like for fluid connections. Quick disconnect couplings have long lived in industrial settings, where design tolerances, qualification habits, and manufacturing controls matched those use cases. Data center liquid cooling—along with aerospace/defense and … [Read more...]
THERMINIC 2025: A Landmark Workshop on Thermal Management and Electronics Reliability
The 31st international workshop on THERMal INvestigations of ICs and systems (THERMINIC) took place on 24–26 September 2025 in Naples, Italy, hosted at the Centro Congressi (Conference Center) of University Federico II. This year’s workshop not only broke attendance records but also showcased the seamless integration of cutting-edge research and industrial innovation in the … [Read more...]
Sheetak Expands Thermoelectric Offering with New TEG Solutions for Energy Harvesting Applications
Solid-state power generation modules enable reliable, compact energy sources for remote and rugged environments. AUSTIN, TX – Sheetak Inc., a U.S.-based leader in thermoelectric innovation, is expanding its product line with a new range of thermoelectric generators (TEGs), offering reliable, solid-state energy harvesting for applications where conventional power sources fall … [Read more...]
Airsys Introduces the PowerOne™ AI-Era Cooling Solutions for Modern Data Centers
As data-center rack densities climb and AI/HPC workloads expand, cooling infrastructure must evolve. Traditional approaches face growing limitations in capacity, scalability, efficiency and footprint. The Airsys PowerOne platform addresses these challenges through a modular, multi-medium cooling architecture engineered for modern compute environments. Technical Highlights … [Read more...]
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