Industrial air conditioner units are typically the solution for cooling sealed enclosures. What designers sometimes fail to consider, however, is that a cooler ambient environment could be used to help cool warmer electrical enclosure, particularly when there is a temperature difference between the internal target temperature and the surrounding temperature of ∆T≥10°C. … [Read more...]
The Liquid Cooling Fluid Connector of the Future
Sponsored by CPC Introducing the liquid cooling fluid connector of the future: the PLQ2. This revolutionary new connector is made from a high performance thermoplastic that offers a host of benefits including: freedom from corrosion, compatibility with engineered cooling fluids and drip-free disconnects. Once you see what the future looks like, you’ll never turn … [Read more...]
Laird Thermal Systems Launches New Company with Advent International Investment
December 18, 2018 -- Laird Thermal Systems, an end-to-end thermal management solution provider, is now a fully-operational, independent business owned by Advent International. As a global organization, Laird Thermal Systems has the product portfolio, technical expertise, global manufacturing footprint and lifecycle services to solve complex thermal challenges and deliver … [Read more...]
CoolIT Systems Partners with Intel to Develop Direct Liquid Cooling solutions for Xeon Scalable Processors
CoolIT Systems has partnered with Intel to develop Direct Liquid Cooling solutions for Intel Xeon Scalable CPUs, including the recently announced Advanced Performance processors (codename Cascade Lake) coming in the first half of 2019. Cascade Lake represents a new class of Intel Xeon Scalable processors designed for demanding high-performance computing (HPC), artificial … [Read more...]
One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications
Master Bond EP17HTND-CCM is a new single component epoxy that is not premixed and frozen. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat curable compound has a flowable paste consistency ideal for glob top, chip coating and bonding applications. EP17HTND-CCM meets NASA low outgassing specifications and is … [Read more...]
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