TIMs are vital in optimizing the performance, reliability, and longevity of optical components, such as silicon photonics transceivers in data centers. At Thermal Live Spring 2025, Henkel provided valuable insights into the growing computational demands in data centers and the associated thermal stress risks, highlighting how their thermal interface materials are addressing … [Read more...]
The EDS Leadership Summit: Come Prepared. Leave Aligned.
May 19-23, 2025 at Resorts World Las Vegas Come Prepared. Leave Aligned. We all know how busy EDS week is. With four consecutive days of face-to-face meetings and outings, it’s imperative that you come prepared to ensure the ideas shared with prospective channel partners will lead to impactful solutions. When you come to EDS prepared, you leave aligned on a more predictable … [Read more...]
Measuring the Thermal Conductivity of Anisotropic Heat Spreading Materials
By: Aaditya A. Candadai, Aalok Gaitonde, Shanmukhi Sripada, Justin A. Weibel, Amy M. Marconnet Introduction New high thermal conductivity materials have been developed to enable enhanced heat transport within electronics packages and other thermal management applications. Many of these engineered materials have anisotropic thermal properties inherent to their fabrication, … [Read more...]
Initiation of Joint Research for Achieving High Accuracy in Evaluating Thermal Diffusivity of Silicon Nitride Ceramic Substrates
The AIST Group (consisting of National Institute of Advanced Industrial Science and Technology (AIST) and AIST Solutions Co.) and NGK INSULATORS, LTD. (NGK) have embarked on joint research regarding validating methods for evaluating thermal diffusivity of silicon nitride ceramic substrates used for power semiconductor components (power semiconductor modules) and other such … [Read more...]
Hydraulic and Thermal Characteristics of a Double-Sided Cold Plate – Part 2
Tesla Tear Down, CFD Validation, and Machine Learning to Determine the Performance Limit This study investigates the hydraulic and thermal characteristics of the TESLA AUTOPILOT HW2.5 MODEL 3 Y, which features a double-sided cold plate with PCBs attached on both sides. We present a step-by-step teardown process of the unit, measuring internal dimensions, fin locations, … [Read more...]
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