Introduction The evolution of modern automotive engineering is defined by a single, escalating conflict: the demand for massive computing power versus the shrinking physical space available to house it. As vehicles transition from mechanical machines to "computers on wheels," the thermal management of Advanced Driver Assistance Systems (ADAS) has moved from a secondary … [Read more...]
Highlights From the 19th ASME InterPACK Conference
The 2025 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2025) was held from October 28–30, 2025, at the Hotel Fera Anaheim, a DoubleTree by Hilton, in Anaheim, California. Hosted by the ASME Electronic and Photonic Packaging Division (EPPD), the conference served as a premier forum for advancing … [Read more...]
Silicone-Free Thermal Gap Pads for Optical and Datacom Systems
Editorial Note The following transcript is adapted from a presentation delivered by Henkel at Thermal Live Fall 2025. It is shared here to provide readers with access to the technical discussion in written form. For the complete presentation experience, including slides and audience Q&A, the full session is available to watch on demand. Introduction In this … [Read more...]
Data Center Cooling Options
Modern data centers require advanced cooling solutions to operate at peak performance. As one of the most rapidly growing industries in the world, data centers are changing how we develop new cooling technology at a record pace. The data center market is projected to continue growing by 8.5% per year over the next five years, to over $600 billion by 2029.* Artificial … [Read more...]
Spacecraft Thermal Control in Extreme Environments: Surviving Lunar Night and Martian Dust
Abstract Extreme conditions in interplanetary environments, like lunar night at -173°C and Martian dust storms, require new thermal control systems that go beyond traditional electronics cooling approaches. Martian dust consists primarily of iron-oxide and silicate particles with diameters ranging from 1 to 3 μm. These particles are electrostatically adhesive, capable of … [Read more...]
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