Introduction This Calculation Corner continues Part I, published in the previous issue [1]. Part I described the construction of a typical flip-chip package configuration for high-power chips, consisting of a laminate assembly of materials adhesively bonded together and having different Coefficients of Thermal Expansion (CTE). The process of bonding these different materials … [Read more...]
Thermal Diffusivity
Introduction Thermal diffusivity is a measure of the transient thermal response of a material to a change in temperature and the term thermal diffusivity (α) is defined asα= k/(ρ x cp) where αis the thermal diffusivity (m2/sec) k is the thermal conductivity (W/m-K) ρ is the density (kg/m3) cp is the heat capacity (J/kg-K) It should be noted … [Read more...]
Thermal Strain In Semiconductor Packages, Part I
Introduction Silicon became the semiconductor of choice for ICs because of its electrical properties, not because of its mechanical properties. In the earliest days of ICs when chips were small and power levels were low, the mechanical properties of silicon were of little consequence. However, for some time, the opposite situation has been the norm. Now, there are much larger … [Read more...]
Top 20 Considerations For Selecting Thermal Interface Materials
Introduction Heat is often considered the limiting factor in the advancement of electronics systems. Lower thermal resistance will drive, not follow, future electronic designs. These solutions must be cost effective, user friendly and developed quickly. Thermal interfaces are usually an afterthought to designs but play a huge factor in the performance and reliability to a … [Read more...]
Air-Cooled, Pin Fin Coldwall Design For Operation At Altitude
Introduction Numerous thermal management techniques exist depending on the system, application, and power level. For airborne electronic systems, the most direct approach to thermal management would be to use ambient air or chilled air, provided by the aircraft, routed to and blown across the electronics. However, in some applications potential contaminants in the cooling air, … [Read more...]
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