Introduction Recent advances in computer clusters have resulted in the introduction of higher density server equipment that consumes significant amounts of electrical power and produces an extraordinary amount of heat. Due to this latter attribute, which has alarming consequences with regard to thermal management, the installation of modern computer clusters will require … [Read more...]
The Seebeck Coefficient
In this issue, we address the Seebeck coefficient, a property that determines the performance of thermocouples and Peltier elements. Basically, the Seebeck coefficient is related to the fact that electrons are both carriers of electricity and heat. If a temperature gradient exists over a piece of electrically conductive wire, there is a net diffusion of electrons from the hot … [Read more...]
Thermal Challenges In LED Cooling
Introduction During the last ten years, developments in LED semiconductors have led to an important change in LED applications from that of luminous indicator to that of illuminator. With LEDs now advancing into several lighting fields, LEDs have become one of the standard methods of producing light, joining more traditional sources such as incandescent, fluorescent and … [Read more...]
Toward A Thermal Figure Of Merit For Multi-Chip Packages
Toward A Thermal Figure Of Merit For Multi-Chip Packages Bruce M. Guenin, Ph.D., Associate Editor Introduction Last issue's Calculation Corner dealt with methods for predicting the temperature of each chip in a Multi-Chip Package (MCP) at an arbitrary combination of chip power levels using the principle of superposition [1]. One of the main points of that article was that both … [Read more...]
So Many Chips, So Little Time; Device Temperature Prediction in Multi-Chip Packages
Introduction The same trend that has led to ever-higher levels of integration of computation and processing functions on a single chip is now driving the integration of several chips into the same package. The use of multi-chip packages (MCPs) enables miniaturization of a circuit when it is not practical to incorporate all of the desired functionality on a single chip. The … [Read more...]
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