Introduction Temperature control of microelectronic devices has become more important in recent years. Device miniaturization and higher switching speeds have increased power dissipation substantially. Limiting the maximum die temperature has resulted in an increase of packaging complexity and cost. The failure rates resulting from electromigration and oxide breakdown are … [Read more...]
Comparing Liquid Coolants From Both A Thermal And Hydraulic Perspective
In the May 2006 issue the Calculation Corner focused on the comparison of liquid coolants using the Mouromtseff number [1]. For single phase forced convection, Mouromtseff found this figure of merit, Mo, to follow the form where ρ, k, cp, and � represent the density, thermal conductivity, specific heat (at constant pressure) and dynamic viscosity of the fluid. The … [Read more...]
Exploring the Limits of Air Cooling
Introduction Heat from electronic devices is an integral part of information processing, not a nuisance that can someday be eliminated. This is a physical principle that is independent of the device of information processing. However, when viewed in the historical perspective, the severity of heat problems has not monotonically increased. It came to the fore some time ago, … [Read more...]
Packaging Challenges For High Heat Flux Devices
Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in the packaging of processors. This results not only from the fact that processors typically have the largest overall power dissipation in a … [Read more...]
An Overview of Liquid Coolants for Electronics Cooling
Introduction The cooling of electronic parts has become a major challenge in recent times due to the advancements in the design of faster and smaller components. As a result, different cooling technologies have been developed to efficiently remove the heat from these components [1, 2]. The use of a liquid coolant has become attractive due to the higher heat transfer … [Read more...]
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