The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research contributions, of service to the electronics thermal/thermo-mechanical management community, and of … [Read more...]
Using Thermal Interfaces to Cool Optoelectronic Microprocessors
Recently, Moscow Institute of Physics and Technology researchers Dmitry Fedyanin and Andrey Vyshnevyy have solved and “demonstrated how to efficiently cool optoelectronic microprocessors” by using industry-standard heat sinks, according to Phys.org. Optoelectronic chips’ active plasmonic components tend to overheat from high-speed data transfer, but by switching electrons with … [Read more...]
Redesigned Heat Sinks Using 3D Printers
Plunkett Associates has successfully redesigned heat-sinks to improve convection cooling performance using Direct Metal Laser Sintering (DMLS), or 3D printing. “Each heat-sink was first produced in virtual form and simulated using Computational Fluid Dynamics (CFD) software,” reported 3Ders.org. “The top five heat-sinks were then built by 3T RPD Ltd. using DMLS and physically … [Read more...]
New Cooler Can Advance Heat Exchanger Technology
Recently, researchers at the Energy Department’s Sandia National Laboratories have developed an innovative new air-cooling technology called the Sandia Cooler. “The Sandia Cooler combines a fan and a finned metal heat sink into a single element called a heat-sink-impeller in which the fins of the heat sink rotate, improving heat transfer by a factor of ten,” reports … [Read more...]
Heat Sink Optimization through Use of Pin Fins
In a recent blog post, Robert Smith discusses heat sink optimization through the use of pin fins. “Local heat transfer coefficients are highest when the air first begins to form a boundary layer. The benefit to lots of pins is that you force the boundary layers to break away often and re-create on the next pin,” Smith said. The heat sink forms a 3D mesh of pins that cross … [Read more...]
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