Nomenclature Variables R Thermal Resistance [°C/W] or [°C-mm2/W] Q Power [W] Q" Heat Flux [W/cm2] T Temperature [°C] or [K] h Heat Transfer Coefficient [W/cm2-K] Subscripts sat saturation tc thermocouple s sink or boiler w wall j junction layer of die a ambient f fluid or saturation c chip surface boil associated with … [Read more...]
Cooling Solutions In The Past Decade
Introduction In 1995, a typical thermal design engineer was aware that removing heat was not going to get any easier in the next few years. A look back at the past ten years reveals that thermal management remained a challenging field. Fortunately, developments and improvements in thermal management hardware have assisted the electronics packaging community by enabling higher … [Read more...]
Advances In High-Performance Cooling For Electronics
Introduction The need for new cooling techniques is driven by the continuing increases in power dissipation of electronic parts and systems. In many instances standard techniques cannot achieve the required cooling performance due to physical limitations in heat transfer capabilities. These limitations are principally related to the limited thermal conductivity of air for … [Read more...]
High Powered Chip Cooling — Air and Beyond
Introduction Over the past few years many people in the electronics industry have become concerned with the increases in heat density at both the chip and module level of packaging. This trend is not new and has been with us since the days of bipolar chips. As can be seen in Figure 1, the heat flux associated with bipolar circuit technologies steadily increased from the … [Read more...]
Latest Developments In Thermoelectrically Enhanced Heat Sinks
Nomenclature Q Heat load (W) COP Coefficient of Performance I Electrical current (Amps) T Temperature (°C) R Electrical resistance (Ohms) Z TE Figure of Merit (1/K) where Z = α2 / (ρ λ) Greek Letters Δ Change in value θ Thermal resistance (°C/W) ρ Electrical resistivity (Ohm-cm) α Seebeck coefficient (V/K) λ Thermal conductivity … [Read more...]
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