At this year's Thermal Live Spring Summit, Inventec discussed a pivotal topic — PFAS (per- and polyfluoroalkyl substances) and their crucial role in cooling systems extensively used by data centers. This topical content springs debates about alternative approaches such as 2 phase immersion cooling, regulation of PFAS across various regions, concerns related to the health and … [Read more...]
Baltimore Aircoil Company Highlights Customized Data Center Cooling Solutions
Jessup, MD – Baltimore Aircoil Company (BAC), the global leader in modular cooling equipment, highlights its cooling solutions ideal for data center applications. Data centers use a dense network of computing and storage that enable the processing and delivery of applications and data for organizations. Mitigating heat and humidity is a leading concern around data center … [Read more...]
Blue Laser Welding Increases Vapor Chamber Fabrication Efficiency
We all understand that higher circuit density and increasingly compact microelectronic devices have created a need for more efficient cooling. Vapor chambers have emerged as a widely employed solution in some of the most demanding microelectronics applications. They are already found in high-performance computers, such as servers, workstations, and personal gaming desktops and … [Read more...]
Adding Function, Value, and Performance to Direct-to-Chip (DTC) Cold Plates With Ultrasonic Additive Manufacturing
Lance Dumigan Fabrisonic, LLC Mark Norfolk Fabrisonic, LLC Practical Knowledge Gained “The performance of DTC cold plates can be enhanced by a new method of fabrication called Ultrasonic Additive Manufacturing (UAM). Building DTC cold plates with UAM could enhance performance and functionality.” The direction of Artificial intelligence and High Power Computing … [Read more...]
The Applicability of JESD51-14 for the Determination of Junction to Case Thermal Resistance
Rjc (or sometimes ThetaJC, θjc, Rth_jc), the so-called ‘junction to case’ thermal resistance, is a thermal metric that enables comparison of the thermal performance of packaged semiconductor devices from differing suppliers. The JEDEC standard JESD51-14 [1] documents a method for the experimental determination of Rjc. Although applicable for packages that exhibit a … [Read more...]
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