Accelerated Market Adoption of Direct Liquid Cooling and Key Partnerships Lead to Another Bright Year Ahead. CALGARY, Alberta, April 6, 2021 /PRNewswire-PRWeb/ -- CoolIT Systems, the global leader in scalable direct liquid cooling technology (DLC) for desktop and data centers systems with over 4 million coldplate solutions shipped to date, has reached a significant business … [Read more...]
One Part Fast Curing Epoxy for Bonding and Small Encapsulation Applications
Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C, unlike conventional one component heat curing systems. It features a quick cure profile at 65°C for 90 minutes plus 30 minutes at 80-85°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. Free flowing … [Read more...]
Spring Pin Socket for ASE’s SIP LGA
Socket your LGA297 using Extreme Temperature Socket with Superior Electrical Performance January, 2021 Ironwood Electronics recently introduced a new LGA socket addressing high-performance requirements for 0.5mm pitch LGA297 – CBT-LGA-5029. The contactor is a stamped spring pin with 31 gram actuation force per pin and cycle life of 125,000 insertions. The self-inductance … [Read more...]
Precision-Clad Composite Materials for Heat Spreaders in Handheld Electronics
The selection of heat-spreader materials is an important consideration for cooling modules in handheld electronic systems. Heat spreaders are typically used in close contact with the source of heat. This can be, for example, a subcomponent, chip, or microelectronic package. The heat spreader transfers and distributes heat from the source to a heat sink through a thermal … [Read more...]
Laird Thermal Systems™ Premium Thermoelectric Coolers Provide Temperature Stability for Outdoor Security Cameras
The new HiTemp ETX Series of thermoelectric coolers keep imaging sensors cool in high-temperature environments... November 4, 2020 – Imaging sensors and other sensitive camera components such as FPGA's require active cooling to keep operating temperatures below their maximum limit, ensuring high-quality image resolution. Due to solar radiation and increased heat flux … [Read more...]
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