Alloy Enterprises, a manufacturing company revolutionizing data center cooling with its novel Stack Forging™ process, today introduced a new copper direct liquid cooling (DLC) solution. As chip power densities and thermal design power rise—pushing AI server rack power densities beyond 120 kW—traditional cooling methods are reaching their limits. With Stack Forging, Alloy … [Read more...]
Data Centre Solutions Division From LFB Group Launches Lennox Branded Fan Wall
Adding to its innovative ‘ApX Series’ range of cooling infrastructure for hyperscale and edge data centres, LFB Group has launched its brand new Fan Wall Unit (FWU) - a high-performance, modular solution built to meet the fast-evolving demands of modern computing environments. LFB Group, following its transition from Lennox EMEA in April 2025, brings over sixty years of … [Read more...]
NEW PRODUCT: Protect Sensitive Electronics in Explosive Environments with New Aluminum ATEX Cabinet Cooler Systems
EXAIR’s ATEX Cabinet Cooler® Systems deliver a powerful and affordable solution for keeping electrical enclosures cool in hazardous ATEX classified areas—and they’re now available in durable aluminum construction. Engineered for use in Zones 2 and 22, these coolers are UL tested, CE compliant, and meet stringent ATEX standards for purged and pressurized enclosures. With … [Read more...]
New Loctite Automotive Potting Solutions Ensure Outstanding Protection from Transmission Fluids, Thermal Shocks
Going the distance: Advanced automotive potting solutions from Henkel maintain electronic components’ performance, durability, and longevity As connected vehicles and autonomous driving functions become increasingly important to the driving experience, the reliability, durability, and performance of the underlying electronic components is fundamental. To ensure this, … [Read more...]
Why Low Gassing Adhesives Matter
The aerospace, electronic, and optical industries often involve environments where outgassing from adhesives can pose significant challenges. When exposed to vacuum or elevated temperatures, conventional adhesives may release volatile compounds, leading to contamination or performance degradation of sensitive components. To mitigate these risks, engineers might consider low … [Read more...]
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