Irvine, California – Last week, Henkel was honored with yet another industry award for its thermal interface material (TIM) ingenuity. BERGQUIST® Liqui-Form TLF 6000HG received a Global Technology Award in recognition the material’s performance benefits and ability to enhance the reliability of 5G telecom infrastructure devices through durable, effective heat … [Read more...]
Heat-Blocking Defects Detected Acoustically
In the landing gear control module of an aircraft, a high-voltage IGBT is about to fail. In the solder bonding one chip’s ceramic base to its heat sink are three small air bubbles—voids, in the vocabulary of electronic failures. The three voids are close together, and the largest is almost directly under a hot spot on the die. Collectively the voids have diminished … [Read more...]
Setting the Standard for TIMs
Carteret, NJ —Tuesday, September 22, 2020— To accommodate diverse thermal cooling requirements, Fujipoly® offers (4) formulations of Standard Performance Gap Filler Pads. Each of the products in the SARCON® Standard Performance series have a different material construction in order to perfectly balance the performance demands of Thermal Conductivity, Thermal Resistance, Gap … [Read more...]
Neograf Solutions Introduces Next Generation Thermal Management Solutions For Electronics
NeoNxGen™ Single Layer Flexible Graphite Eliminates Cost, Complexity, and Reliability Issues of Multi-Layer Systems LAKEWOOD, OHIO USA - NeoGraf Solutions, a leading developer and manufacturer of high-performance natural and synthetic graphite sheets and powders, has launched NeoNxGen™ Thermal Management Solutions, a family of high-performance, thick, single layer … [Read more...]
Two-Component Room Temperature Curing Thermally Conductive And Electrically Insulating Adhesive
Ayer, MA, August 2020 New Product – Creative Materials introduces 813-76, a two-component room temperature curing thermally conductive and electrically insulating adhesive. This product is designed for assembling heat-sensitive components on printed circuit boards, and it develops strong adhesive bonds and excellent thermal transfer. 813-76 provides high impact bonds … [Read more...]
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