UPenn Physicists Discover New Material that May Cool Computers

May 5th, 2015

Heat emitted from computers, laptops and other electronic devices during use is regularly caused by numerous transistors overcrowded in the devices. This also expels large amounts of wasted heat energy. A pair of physicists from…read more

Cooling System for Computer Processors Could Save Consumers Billions

May 5th, 2015

A patented passive cooling system for computer processors could save U.S. consumers more than 6.3 billion dollars in electricity costs per year. The system is currently being manufactured at the University of Alabama in Huntsville…read more

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Trio of Companies to Improve Graphite Thermal Management Products

April 27th, 2015

Three Canadian companies, Terrella Energy Systems, Alpha Technologies, and Westport Innovations, have partnered up to improve low-cost graphite thermal management products. The companies have partnered with researchers at Simon Fraser University and Ontario’s Sheridan College…read more

Company Brings Liquid Cooling Technology to Smartphones

April 27th, 2015

Reducing size of liquid cooling systems has been a challenge for companies in the electronics cooling industry for many years.  Fujitsu introduces a 1mm thick liquid cooling heat pipe for compact electronic devices such as…read more

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New Research to Improve Semiconductor Industry and Electronic Devices

April 27th, 2015

Chemists from the University of Georgia have successfully isolated silicon oxide fragments for the first time at room temperature. Chemists accomplished this by using a technique developed in 2008 which involves trapping silicon oxide fragments…read more

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Scientist Uses Virus to Slow Down Water Boiling; Improves Cooling of Electronics

April 14th, 2015

Matthew McCarthy, Ph.D., a scientist from Drexel University, has discovered the process of boiling water can be sped up with aid of a virus. McCarthy realized improvements are not made to the surface used to…read more

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Engineer Develops Nanoscale Pillars to Produce More Efficient Electronics

April 14th, 2015

Seong Jin Koh, an engineer from the University of Texas at Arlington, has received a $300,000 grant that will allow him to build nanoscale pillars, which will lead to more energy-efficient transistors in electronic devices.…read more

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Startup Utilizes Waste Heat and Lowers Server Computing Costs

April 14th, 2015

Nerdalize, a Dutch startup company, wants to utilize waste heat generated from servers to heat homes for free. The company offers “eRadiators,” which are high-performance servers that also act as radiators. The company plans to…read more

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ASU Engineer’s Computing Node Research Suggests Large Reduction in Energy Usage

April 7th, 2015

Carole-Jean Wu, computer scientist and engineer at Arizona State University, is gaining recognition for her work to improve energy efficiency of computing nodes, which includes everything from smartphones and tablets, to desktop processors and data…read more

Summary of ‘Thermal Interface Materials Predictions 2015-2025’

April 7th, 2015

A new book titled “Thermal Interface Materials 2015-2025: Status, Opportunities and Market Forecasts” has been released.  “The state of the market in 2015, a geographic breakdown of the market, and forecasts to 2025, are separated…read more

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Combination of Polymers Yields Advantages for Electronics Manufacturers and Lighting Industry

April 7th, 2015

The high cost of LED bulbs has resulted in manufacturers in the lighting industry to reduce costs and improve performance in the assembly process. Nicolas Sunderland, senior scientist, and Terry G. Davis, principal engineer of…read more

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Liquid Cooling in Mobile Devices Increases Heat Dissipation Speeds

March 24th, 2015

Fujitsu Engineers have reportedly discovered a better way to dissipate heat from mobile devices. By using liquid cooling, heat dissipation occurs five times faster than current dissipation methods. “It’s built a microscale heat pipe, less…read more

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Overheating Issues Stall Release of Sony’s Xperia Z4

March 24th, 2015

The release of Sony’s Xperia Z4 has been delayed due to heat dissipation issues in the Snapdragon 810 processor in the device. The Snapdragon 810 chip reportedly has overheating issues and Sony is working to…read more

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New Data Center Design Reduces Space; Increases Cooling Productivity

March 24th, 2015

One company hopes to create an entirely new design for data centers for the industry. Vapor IO introduces a new “Data Center Aisle” concept.  This vapor chamber design encompasses a room filled with round black…read more

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