Liquid Cooling in Mobile Devices Increases Heat Dissipation Speeds

March 24th, 2015

Fujitsu Engineers have reportedly discovered a better way to dissipate heat from mobile devices. By using liquid cooling, heat dissipation occurs five times faster than current dissipation methods. “It’s built a microscale heat pipe, less…read more

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Overheating Issues Stall Release of Sony’s Xperia Z4

March 24th, 2015

The release of Sony’s Xperia Z4 has been delayed due to heat dissipation issues in the Snapdragon 810 processor in the device. The Snapdragon 810 chip reportedly has overheating issues and Sony is working to…read more

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New Data Center Design Reduces Space; Increases Cooling Productivity

March 24th, 2015

One company hopes to create an entirely new design for data centers for the industry. Vapor IO introduces a new “Data Center Aisle” concept.  This vapor chamber design encompasses a room filled with round black…read more

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Company Introduces Liquid Cooling Specified Couplings at SEMI-THERM

March 17th, 2015

Colder Products Company (CPC), a provider of couplings and fittings, announces the expansion of its LQ product family. The RPLQ4 series of couplings is designed for liquid cooling applications and offer security, reliability, and are…read more

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March 16th, 2015

Find pictures, videos and more from the SEMI-THERM 31 here! Check back daily during the symposium for updated content. “Pressure Effects of TIM on Mechanical Assemblies” Presentation:                …read more

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Thermal Test Chips on Display at SEMI-THERM

March 13th, 2015

Thermal Engineering Associates (TEA) will display Thermal Test Chips and Wafers at SEMI-THERM at booth 300. The wafers on display range from 200mm and 300mm and thicker ones range from 700mm to 800mm. Thinner wafers will…read more

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Company Hosts Workshop and Announces New Products

March 13th, 2015

Honeywell Electronic Materials (HEM) will make a new product announcement during SEMI-THERM 2015. Honeywell also recently announced its TIMS are being integrated into the production of Video Graphic Array cards to help them stay cool…read more

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Google’s 10 rules for Designing Data Centers Include Cooling Tips

March 10th, 2015

Google announces its 10 rules for designing data centers. Joe Kava, vice president of Google’s data centers, noted that the rules follow the original 10 core principles of the company. Google’s first rule is “Focus…read more

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Immersion Cooling Emerges as New Cooling Technology

March 9th, 2015

Immersion cooling, in which electronics are submerged in liquid coolants, is gaining popularity in the cooling industry. Companies have become aware of the benefits of immersion cooling in extreme environments, such as oil rigs or…read more

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Electronics Cooling March 2015 Issue Now Online

February 24th, 2015

Don’t miss out on the March 2015 issue of Electronics Cooling, which includes feature articles on Design Optimization of a Multi-device Single-phase Branching Microchannel Cold Plate; Circuit Card Assembly Heat Sinks; Thermal Power Plane Enabling…read more

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Nutella used as a Thermal Paste

February 20th, 2015

On February 5, which was World Nutella Day, Cool Master celebrated the hazelnut-chocolate spread by using Nutella as a thermal paste. The firm heated the Nutella first and cleaned the CPU before applying the spread.…read more

Graphene Improves Anti-Corrosion Coatings

February 20th, 2015

2-DTech has secured a UK grant for £100,000 to finance a project with a goal of finding a way to improve anti-corrosive coatings through incorporation of graphene. Graphene is a better alternative to copper because…read more

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Ultra-thin and Flexible Thermal Management Device to be Commercialized

February 20th, 2015

An agreement between Kelvin Thermal Technologies and the University of Colorado was struck in order to develop flexible and thin thermal management technologies. This research was also funded by the US Department of Defense under…read more

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World’s Thinnest Silicon Transistor Produced by Research Team

February 10th, 2015

A group of researchers from the Cockrell School of Engineering, lead by assistant professor Deji Akinwande, have successfully created the world’s thinnest silicon transistor. These transistors generate less heat, use less energy, and pave the…read more

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