Thermally Unsuitable Product Dropped from Upcoming Samsung Product Line

January 26th, 2015

Samsung reportedly dropped Qualcomm’s Snapdragon 810 from its upcoming line of Galaxy S6 devices because Qualcomm’s 20nm processors aren’t running cool enough. “That core is a 20nm SoC with a new, DX11.2-capable GPU, H.265 encode…read more

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High Temperature Brings Down Data Center in Australia

January 19th, 2015

A heatwave that rose outside temperatures to 112 degrees Fahrenheit, brought iiNet’s data center down in Western Australia. The data center went offline due to equipment failures. Because servers can give off tremendous amounts of…read more

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Thermal Simulation to Improve LED Car Headlight Design

January 13th, 2015

Structural changes to LED headlights have generally been adding to the complexity of  its production, according to researchers. Certain car models come with a few choices of headlights, such as the new Audi TT which…read more

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Company Raises Funds to Pursue New Market Opportunities and Cooling Solutions

January 13th, 2015

Phononic announces it has raised $44.5 million dollars to develop solid-state cooling solutions for refrigeration and electronics cooling. Phononic’s approach to cooling and heating involves using solid-state technology to provide thermal management solutions. “The company…read more

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Need for Heat Spreaders Yields New Cooling Technologies

January 6th, 2015

The Air Force Research Laboratory (AFRL) and a small business partner have announced they are developing technologies that will help electronics stay cool. With funding from the Air Force Small Business Innovation Research (SBIR) program,…read more

Transformation Optics Used to Analyze Van Der Waals Forces in 3D Plasmonic Systems

January 5th, 2015

Scientists at Imperial College London in London, England have devised a novel way of analyzing tricky 3D plasmonic systems affected by nonlocality – through transformation optics. Though van der Waals forces are relatively easy to…read more

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Company Introduces New French Distributor

January 5th, 2015

Epoxy Technology Inc., a global supplier of thermal interface materials and thermally conductive products, announces a distributor change in Europe. The distributor covering France, Algeria, Morocco and Tunisia has changed from Techni Industries France to…read more

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Scientists Discover New Benefits of Graphene

January 5th, 2015

Scientists from Manchester University have discovered graphene can be used to harvest hydrogen from air and improve efficiency of solar cells. The scientists discovered that thin layers of Graphene can separate hydrogen from air using…read more

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Research Group at U-Michigan Develops Heat-conducting Plastic

December 16th, 2014

A research team from the University of Michigan has developed a heat-conducting plastic that bends 10 times better than previous materials. Plastic is a favorable material for electronic devices because it is lightweight, flexible and…read more

Air Force Funds Thermal Management Project

December 16th, 2014

The Air Force has provided over $1.5 million dollars in funding to the Air Force Research Laboratory for a Small Business Innovation Research (SBIR) effort to improve methods of managing heat of electronics on fighter…read more

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Inorganic-based Laser Lift-off Transforms Flexible Electronics

December 9th, 2014

A group of researchers led by professor Keon Jae Lee of KAIST have reached a breakthrough in flexible electronics – they have developed a method to produce high performance and more flexible electronics by using…read more

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Experiments Demonstrate Graphene is 10 times Stronger than Steel

December 9th, 2014

A research group from Rice University and the University of Massachusetts have discovered that graphene, one of the strongest materials in the world, is 10 times stronger than steel and can stop a speeding bullet.…read more

‘Tech Tidbit’ – Free Heat Exchanger Technology Successfully Cools Earth

December 9th, 2014

A group of engineers from Stanford University, led by Professor Shanhui Han, have developed a free heat exchanger technology that successfully cools the Earth. The radiator system works by beaming heat and sunlight from buildings…read more

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Thermal Test Chip Assists in TIM Testing

November 24th, 2014

Thermal Engineering Associates, Inc. has introduced its new Thermal Test Chip, the TTC-1001. This chip “has capability of supplying a power density of 261W/cm2 for performing Thermal Interface Material (TIM) testing, evaluating package thermal characteristics,…read more

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