News

Underwater Data Center Test Proves Successful

February 1st, 2016

Microsoft, who manages more than 100 data centers around the world, has completed testing of a self-contained data center prototype that can operate hundreds of feet below the surface of the ocean. The New York…read more

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New Lithium-Ion Battery Prevents Itself from Overheating

February 1st, 2016

Researchers at Stanford have designed the first lithium-ion battery that can shut down and restart on its own to prevent overheating. “The battery shuts [itself] down before overheating, then restarts immediately when the temperature cools,”…read more

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Electronics Cooling Tech Adapted for Organ Transport by Drones

February 1st, 2016

Four women, with support from the IFFE Business School in Spain, have created an unmanned aerial vehicle, Dronlife, with its own cooling system to transport organs in India. “Dronlife uses Peltier cells, devices used in…read more

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Using Thermal Interfaces to Cool Optoelectronic Microprocessors

January 25th, 2016

Recently, Moscow Institute of Physics and Technology researchers Dmitry Fedyanin and Andrey Vyshnevyy have solved and “demonstrated how to efficiently cool optoelectronic microprocessors” by using industry-standard heat sinks, according to Phys.org. Optoelectronic chips’ active plasmonic components…read more

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New “Kinetic Cooling Engine” CPU Cooler Design

January 20th, 2016

Startup MIT company, CoolChip, demonstrated a new commercial prototype CPU cooler recently at CES. “They’ve partnered with Cooler Master to release a “kinectic cooling engine” that can cool a chip 50 percent more efficiently than…read more

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Redesigned Heat Sinks Using 3D Printers

January 20th, 2016

Plunkett Associates has successfully redesigned heat-sinks to improve convection cooling performance using Direct Metal Laser Sintering (DMLS), or 3D printing. “Each heat-sink was first produced in virtual form and simulated using Computational Fluid Dynamics (CFD)…read more

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Protection Coatings for Coolers to be Presented at Upcoming Conference

January 18th, 2016

On February 26 at the Photonics West Conference in San Francisco Rogers Corporation’s Power Electronics Solutions (PES) will be presenting a report on ACT’s vapor-deposited Applied Nanoscale Corrosion Resistant (ANCER™) coatings in partnership with Advanced Cooling…read more

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“Breakthrough Products of the Year” Award Winner

January 18th, 2016

Enclosure manufacturer, Rittal Corporation, has won Processing magazine’s 2015 Breakthrough Products of the Year award for their Blue e+ Cooling Unit Series for enclosures. “The award recognizes products, technologies and services that have made significant contributions…read more

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“Electronics Cooling” Seeks Technical Editor

January 12th, 2016

As part of our continued growth, Electronics Cooling is searching for an additional Technical Editor to support the sourcing and production of content for ElectronicsCooling.com, the Electronics Cooling enewsletter, the Thermal Live annual online event,…read more

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Innovative Liquid Cooling Technology for the ExaNeSt Project

January 8th, 2016

Iceotope is using innovative liquid cooling technology for the European project ExaNeSt as reported by Inside HPC. The ExaNeSt project objective is to develop a prototype exascale supercomputer in three years. Peter Hopton from Iceotope…read more

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New Solid-State Wine Cellar Cooling Technology

January 8th, 2016

At the recent Consumer Electronics Show, Haier America introduced its “new alternative cooling system for wine cellars,” as reported by DigitalTrends.com. This technology “couples a solid-state chip that is 25 times lighter and 100 times smaller…read more

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Half of North America Upgrading Data Center Cooling Systems

January 8th, 2016

New research done by Emerson Network Power recently shows that nearly 50 percent of the United States and Canada have made thermal upgrades to their data center cooling systems. According to the survey of “IT,…read more

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A Liquid Cooling Method for FPGAs

January 6th, 2016

Georgia Institute of Technology researchers are using microfluidic channels to cool 28nm Altera FPGAs. The university said that by “flowing de-ionized water through” the “microfluidic passages cut directly into the backsides of production FPGAs […]…read more

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New Design for Fighter’s Thermal Management Tech

January 6th, 2016

Northrop Aerospace Systems has released a new artistic concept of a sixth-generation fighter that will combine new technology present in the Lockheed Martin F-22 and B-2 with new thermal management technology. According to FlightGlobal.com, Northrop…read more

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