Alloy Enterprises, a manufacturing company revolutionizing data center cooling with its novel Stack Forging™ process, today introduced a new copper direct liquid cooling (DLC) solution. As chip power densities and thermal design power rise—pushing AI server rack power densities beyond 120 kW—traditional cooling methods are reaching their limits. With Stack Forging, Alloy … [Read more...]
Data Centre Solutions Division From LFB Group Launches Lennox Branded Fan Wall
Adding to its innovative ‘ApX Series’ range of cooling infrastructure for hyperscale and edge data centres, LFB Group has launched its brand new Fan Wall Unit (FWU) - a high-performance, modular solution built to meet the fast-evolving demands of modern computing environments. LFB Group, following its transition from Lennox EMEA in April 2025, brings over sixty years of … [Read more...]
A New Method to Measure Thermal Conductivity
Conventional steady-state thermometry techniques require hours to reach a steady-state temperature rise — but a new method using laser heating takes only seconds. At Thermal Live Spring 2025, presenters from Laser Thermal demonstrated a Thermo-Optical Plane Source (TOPS) technique that offers unmatched speed and flexibility. Designed for high-throughput testing across a wide … [Read more...]
NEW PRODUCT: Protect Sensitive Electronics in Explosive Environments with New Aluminum ATEX Cabinet Cooler Systems
EXAIR’s ATEX Cabinet Cooler® Systems deliver a powerful and affordable solution for keeping electrical enclosures cool in hazardous ATEX classified areas—and they’re now available in durable aluminum construction. Engineered for use in Zones 2 and 22, these coolers are UL tested, CE compliant, and meet stringent ATEX standards for purged and pressurized enclosures. With … [Read more...]
Solving the Heat Dilemma for Optical Transceivers: What’s Next for TIMs?
TIMs are vital in optimizing the performance, reliability, and longevity of optical components, such as silicon photonics transceivers in data centers. At Thermal Live Spring 2025, Henkel provided valuable insights into the growing computational demands in data centers and the associated thermal stress risks, highlighting how their thermal interface materials are addressing … [Read more...]
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