Introduction The introduction of large language models (LLM), such as ChatGPT, has made artificial intelligence highly accessible. One of the key driving forces behind this growth has been the advancement in the processing power of compute devices such as central processing units (CPUs) and graphics processing units (GPUs). An increase in this processing power is … [Read more...]
Gates Strengthens Data Center Portfolio with Launch of Data Master™ Eco
Gates Corporation, a global manufacturer of innovative, highly engineered power transmission and fluid power solutions, has launched Data Master™ Eco. This next-generation liquid cooling solution is designed to support hyperscale data centers and high-performance computing (HPC) conditions to maximize uptime, reduce environmental impact and meet the complex AI-enabling, data … [Read more...]
Alloy Enterprises Extends Direct Liquid Cooling Across the Blade, Eliminating the 100 kW Peripheral Heat Bottleneck
Boston, MA – November 5, 2025 – Alloy Enterprises today announced a breakthrough in data center cooling: single-piece, leak-tight cold plates that extend direct liquid cooling (DLC) across the blade, including DIMMs, NICs, and QSFPs. Built using the company’s patented Stack Forging™ process, the new design enables full-blade liquid cooling for the first time, eliminating the … [Read more...]
In-Package, Direct-on-chip Liquid Cooling with Lid-Compatible Manifold for Efficient AI Chip Thermal Management
Introduction The advancement of artificial intelligence (AI) has led to an accelerating development of high-performance AI chips, which are increasingly characterized by ultra-large die areas, extreme interconnect density, and high-power consumptions. Heat dissipation is a bottleneck for the next-generation high-power graphics processing unit (GPU) and necessitates advanced … [Read more...]
IEEE ITherm 2025 Conference Highlights
The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the Gaylord Texan Resort and Convention Center, Dallas, TX, May 27 – 30, 2025. This was the 24th ITherm Conference. ITherm Conference series began in 1988 as a companion conference to the broader IEEE Electronic Packaging Society’s (at that time CHMT, later … [Read more...]
