Conventional steady-state thermometry techniques require hours to reach a steady-state temperature rise — but a new method using laser heating takes only seconds. At Thermal Live Spring 2025, presenters from Laser Thermal demonstrated a Thermo-Optical Plane Source (TOPS) technique that offers unmatched speed and flexibility. Designed for high-throughput testing across a wide … [Read more...]
NEW PRODUCT: Protect Sensitive Electronics in Explosive Environments with New Aluminum ATEX Cabinet Cooler Systems
EXAIR’s ATEX Cabinet Cooler® Systems deliver a powerful and affordable solution for keeping electrical enclosures cool in hazardous ATEX classified areas—and they’re now available in durable aluminum construction. Engineered for use in Zones 2 and 22, these coolers are UL tested, CE compliant, and meet stringent ATEX standards for purged and pressurized enclosures. With … [Read more...]
Solving the Heat Dilemma for Optical Transceivers: What’s Next for TIMs?
TIMs are vital in optimizing the performance, reliability, and longevity of optical components, such as silicon photonics transceivers in data centers. At Thermal Live Spring 2025, Henkel provided valuable insights into the growing computational demands in data centers and the associated thermal stress risks, highlighting how their thermal interface materials are addressing … [Read more...]
The EDS Leadership Summit: Come Prepared. Leave Aligned.
May 19-23, 2025 at Resorts World Las Vegas Come Prepared. Leave Aligned. We all know how busy EDS week is. With four consecutive days of face-to-face meetings and outings, it’s imperative that you come prepared to ensure the ideas shared with prospective channel partners will lead to impactful solutions. When you come to EDS prepared, you leave aligned on a more predictable … [Read more...]
Measuring the Thermal Conductivity of Anisotropic Heat Spreading Materials
By: Aaditya A. Candadai, Aalok Gaitonde, Shanmukhi Sripada, Justin A. Weibel, Amy M. Marconnet Introduction New high thermal conductivity materials have been developed to enable enhanced heat transport within electronics packages and other thermal management applications. Many of these engineered materials have anisotropic thermal properties inherent to their fabrication, … [Read more...]
