Abstract This paper presents a novel thermal management approach for power semiconductor modules by integrating active liquid cooling directly into the substrate. Utilizing Direct Bond Copper (DBC) structures embedded within liquid cold plates, the method minimizes thermal interfaces, improves power density, and ensures better reliability. It contrasts traditional … [Read more...]
Simulation of Two-Phase Microchannel Heat Sink Performance: Refrigerant, Inlet Conditions, and Hot Spots Effects
Introduction The introduction of large language models (LLM), such as ChatGPT, has made artificial intelligence highly accessible. One of the key driving forces behind this growth has been the advancement in the processing power of compute devices such as central processing units (CPUs) and graphics processing units (GPUs). An increase in this processing power is … [Read more...]
In-Package, Direct-on-chip Liquid Cooling with Lid-Compatible Manifold for Efficient AI Chip Thermal Management
Introduction The advancement of artificial intelligence (AI) has led to an accelerating development of high-performance AI chips, which are increasingly characterized by ultra-large die areas, extreme interconnect density, and high-power consumptions. Heat dissipation is a bottleneck for the next-generation high-power graphics processing unit (GPU) and necessitates advanced … [Read more...]
Sheetak Strengthens U.S. Thermoelectric Manufacturing with Custom Solutions and Rapid Prototyping
Custom thermoelectric devices, faster prototypes, and reliable U.S. manufacturing for critical industries. Sheetak Inc., a U.S.-based leader in advanced thermoelectrics, is redefining solid-state cooling and energy management with fully customizable devices and rapid prototyping through its expanded U.S. manufacturing capabilities. Headquartered in Austin, Texas, Sheetak … [Read more...]
Statistics Corner: Modifying Sample Size
Author’s note: This article was initially published in a compilation of some of the articles published in the Electronics Cooling Magazine ‘Statistics Corner’ [4]. However, it was never published as part of a standard ECM issue. Therefore, it seemed appropriate to reintroduce it to the readers to this series on statistical analysis methods. Abstract Reliability … [Read more...]
- « Previous Page
- 1
- 2
- 3
- 4
- 5
- 6
- …
- 41
- Next Page »
