The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the Gaylord Texan Resort and Convention Center, Dallas, TX, May 27 – 30, 2025. This was the 24th ITherm Conference. ITherm Conference series began in 1988 as a companion conference to the broader IEEE Electronic Packaging Society’s (at that time CHMT, later … [Read more...]
Remembrances of Clemens Lasance
Days before the last issue of Electronics Cooling Magazine was published, we heard news that a significant contributor to our industry, Clemens Lasance, had passed away. Clemens was a long-time editor of this magazine, as well as contributing to the success of multiple conferences and technology developments while at Philips. Besides, Clemens served as a mentor to many of us … [Read more...]
Statistics Corner: Modifying Sample Size
Author’s note: This article was initially published in a compilation of some of the articles published in the Electronics Cooling Magazine ‘Statistics Corner’ [4]. However, it was never published as part of a standard ECM issue. Therefore, it seemed appropriate to reintroduce it to the readers to this series on statistical analysis methods. Abstract Reliability … [Read more...]
Performing a Transient Thermal Characterization of Hardware with a Finite Difference Model
Introduction A transient thermal characterization, also known as a thermal survey, aims to characterize the location of greatest thermal inertia within a hardware system—that is, the location with the slowest temperature response to a given environmental stimulus. This manuscript outlines a methodology for developing a finite difference numerical model of a three-resistor, … [Read more...]
Thermal Design for Externally Worn Wearable Electronics
Introduction Thermal management plays a critical role in the performance, reliability, and longevity of wearable devices. Reliability must be considered even when components remain below their absolute maximum operating temperatures. This is due to increased diffusion rates, material fatigue, and electromigration effects which degrade electronics over time. Additional failure … [Read more...]
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