Introduction The advancement of artificial intelligence (AI) has led to an accelerating development of high-performance AI chips, which are increasingly characterized by ultra-large die areas, extreme interconnect density, and high-power consumptions. Heat dissipation is a bottleneck for the next-generation high-power graphics processing unit (GPU) and necessitates advanced … [Read more...]
IEEE ITherm 2025 Conference Highlights
The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the Gaylord Texan Resort and Convention Center, Dallas, TX, May 27 – 30, 2025. This was the 24th ITherm Conference. ITherm Conference series began in 1988 as a companion conference to the broader IEEE Electronic Packaging Society’s (at that time CHMT, later … [Read more...]
Remembrances of Clemens Lasance
Days before the last issue of Electronics Cooling Magazine was published, we heard news that a significant contributor to our industry, Clemens Lasance, had passed away. Clemens was a long-time editor of this magazine, as well as contributing to the success of multiple conferences and technology developments while at Philips. Besides, Clemens served as a mentor to many of us … [Read more...]
Statistics Corner: Modifying Sample Size
Author’s note: This article was initially published in a compilation of some of the articles published in the Electronics Cooling Magazine ‘Statistics Corner’ [4]. However, it was never published as part of a standard ECM issue. Therefore, it seemed appropriate to reintroduce it to the readers to this series on statistical analysis methods. Abstract Reliability … [Read more...]
Performing a Transient Thermal Characterization of Hardware with a Finite Difference Model
Introduction A transient thermal characterization, also known as a thermal survey, aims to characterize the location of greatest thermal inertia within a hardware system—that is, the location with the slowest temperature response to a given environmental stimulus. This manuscript outlines a methodology for developing a finite difference numerical model of a three-resistor, … [Read more...]
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