INTRODUCTION Militaries continue to expand their use of electronics in harsh environments while preserving an absolute minimal risk of failure. In this regard, effort spent early in the design process on concept development, parametric and trade-off studies, and simulation-driven design can yield amplified benefits in terms of product performance and reliability, reduced … [Read more...]
Thermal Facts & Fairy Tales: 7 years of college down the drain…
...might as well join the Peace Corps… - John "Bluto" Blutarsky1 I would hazard a guess that the majority of people bothering to read an article on electronics cooling likely work in the electronics industry. Moreover, it is probably a pretty good bet that a lot of them have actually taken a class on heat transfer at some point. Since most of us eventually graduated, it … [Read more...]
Thermal Facts and Fairy Tales: Automated Meshing Philosophy?
Thermal Facts and Fairy Tales: Automated Meshing Philosophy? Peter Rodgers Fairy tales are a well-established way to convey science and technology education. For example, a recent textbook [1] has documented how a range of Victorian-era (1837 – 1901) instructors used fairies and their tales to clarify scientific and technological concepts for young audiences. Today, … [Read more...]
The Appification of CFD Simulation has Started
There has been much talk about the appification of established technologies. Discussion on the appification of high-value CAE simulation seems to have focused on the fact that it's a when, not if. How such a conclusion has been made without a clarification of what 'appification' actually is, is confounding. Apps are cheap, limited in the scope of their application and, as a … [Read more...]
Room Temperature Metal Bonding – Heralding a Revolution In IC Performance and Reliability?
A reliable electronic product is generally a cool one. In addition, one of the main limiters of non-functional performance is operating temperature. Keep your product cool and it will last longer and/or operate faster. Electronics thermal management has been dogged by thermal resistances at part/part interfaces for decades. Reduce these main bottlenecks in the heat flow path … [Read more...]
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