Socket your LGA297 using Extreme Temperature Socket with Superior Electrical Performance January, 2021 Ironwood Electronics recently introduced a new LGA socket addressing high-performance requirements for 0.5mm pitch LGA297 – CBT-LGA-5029. The contactor is a stamped spring pin with 31 gram actuation force per pin and cycle life of 125,000 insertions. The self-inductance … [Read more...]
Precision-Clad Composite Materials for Heat Spreaders in Handheld Electronics
The selection of heat-spreader materials is an important consideration for cooling modules in handheld electronic systems. Heat spreaders are typically used in close contact with the source of heat. This can be, for example, a subcomponent, chip, or microelectronic package. The heat spreader transfers and distributes heat from the source to a heat sink through a thermal … [Read more...]
Bergquist® Liqui-Form TLF 6000HG Thermal Gel Earns Industry Award
Irvine, California – Last week, Henkel was honored with yet another industry award for its thermal interface material (TIM) ingenuity. BERGQUIST® Liqui-Form TLF 6000HG received a Global Technology Award in recognition the material’s performance benefits and ability to enhance the reliability of 5G telecom infrastructure devices through durable, effective heat … [Read more...]
SANYO DENKI Releases 40 × 40 × 56 mm Counter Rotating Fan With the Highest Static Pressure in the Industry
SANYO DENKI has developed and launched the San Ace 40 9CRJ type 40 × 40 × 56 mm Counter Rotating Fan that features the highest static pressure in the industry.* This fan is suitable for cooling 1U servers, switching power supplies, and communications equipment. It also comes with the PWM control function to control the fan speed. Features: High Static Pressure and High … [Read more...]
Parker’s THERM-A-GAP GEL 37 Is the Next Generation of Single Component Dispensable Thermal Interface Materials
Parker’s THERM-A-GAPTM GEL 37 Is the Next Generation of Single Component Dispensable Thermal Interface Materials Offers improved flow rate control and higher thermal conductivity than THERM-A-GAP GEL 30 Woburn, Mass. – The Chomerics division of Parker Hannifin Corporation, the global leader in motion and control technologies, today announces the launch of THERM-A-GAP GEL … [Read more...]
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