The Laird™ Ttape™ 1000A thermally conductive adhesive tape delivers best-in-class thermal resistance WILMINGTON, Del., June 3, 2022 - Laird Performance Materials, part of DuPont Interconnect Solutions, has capitalized on collaborative innovation with DuPont to introduce Laird™ Ttape™ 1000A thermally conductive adhesive tape, a standalone 50µm adhesive that offers extremely … [Read more...]
Panasonic Develops MEGTRON 8 Multi-Layer Circuit Board Materials Featuring Low Transmission Loss for High-Speed Communication Networking Equipment
Osaka, Japan - Panasonic Corporation announced today that its Industry Company has developed MEGTRON 8[1] Multi-Layer Circuit Board Materials Featuring Low Transmission Loss [2], designed for high-speed communication networking equipment such as routers and switches. The worldwide deployment of the fifth-generation mobile communication system (5G) is fostering the trend of … [Read more...]
Protect Electronic Components with Dam & Fill
Sensitive electronic components mounted on a circuit board often require protection from exposure to harsh environments. While there are several ways to accomplish this, the dam and fill method offers many benefits. Dam-and-filling entails dispensing the damming material around the area to be encapsulated, thereby restricting the flow of the fill from spreading to other parts … [Read more...]
Neograf Solutions’ New Advanced Graphenes Targets Energy Storage Markets
NeoGraf Solutions, a leading developer and manufacturer of high-performance natural and synthetic graphite sheet and powder products, has extended its range of next-generation graphite materials with the launch of Graf-X™ graphene nanoplatelets (GNP) and graphene precursors (GP). Both high-performance additive materials deliver enhanced strength, performance, and reliability in … [Read more...]
Cadence Palladium Z2 Enterprise Emulation Platform Accelerates Microchip’s Data Center Solutions SoC Development
Palladium Z2 Emulation enabled Microchip to achieve 1.5X faster run-time performance and 2X better emulation capacity SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Microchip has deployed the Cadence® Palladium® Z2 Enterprise Emulation Platform for the development of their next generation ASIC products targeting high performance and … [Read more...]
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