Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C, unlike conventional one component heat curing systems. It features a quick cure profile at 65°C for 90 minutes plus 30 minutes at 80-85°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. Free flowing … [Read more...]
Fujipoly® Achieves IATF 16949:2016 Certification
January, 2021 | Carteret, NJ Fujipoly America Corp., a world leader in the production of thermal interface materials and elastomeric connectors, announces that it has achieved IATF 16949:2016 certification. This certification is the highest international quality standard for the automotive industry and reflects Fujipoly’s long-term commitment to delivering quality and … [Read more...]
Bergquist® Liqui-Form TLF 6000HG Thermal Gel Earns Industry Award
Irvine, California – Last week, Henkel was honored with yet another industry award for its thermal interface material (TIM) ingenuity. BERGQUIST® Liqui-Form TLF 6000HG received a Global Technology Award in recognition the material’s performance benefits and ability to enhance the reliability of 5G telecom infrastructure devices through durable, effective heat … [Read more...]
Heat-Blocking Defects Detected Acoustically
In the landing gear control module of an aircraft, a high-voltage IGBT is about to fail. In the solder bonding one chip’s ceramic base to its heat sink are three small air bubbles—voids, in the vocabulary of electronic failures. The three voids are close together, and the largest is almost directly under a hot spot on the die. Collectively the voids have diminished … [Read more...]
Setting the Standard for TIMs
Carteret, NJ —Tuesday, September 22, 2020— To accommodate diverse thermal cooling requirements, Fujipoly® offers (4) formulations of Standard Performance Gap Filler Pads. Each of the products in the SARCON® Standard Performance series have a different material construction in order to perfectly balance the performance demands of Thermal Conductivity, Thermal Resistance, Gap … [Read more...]
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