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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Heat-Blocking Defects Detected Acoustically

 

  In the landing gear control module of an aircraft, a high-voltage IGBT is about to fail. In the solder bonding one chip’s ceramic base to its heat sink are three small air bubbles—voids, in the vocabulary of electronic failures. The three voids are close together, and the largest is almost directly under a hot spot on the die. Collectively the voids have diminished … [Read more...]

Setting the Standard for TIMs

 

Carteret, NJ —Tuesday, September 22, 2020— To accommodate diverse thermal cooling requirements, Fujipoly® offers (4) formulations of Standard Performance Gap Filler Pads. Each of the products in the SARCON® Standard Performance series have a different material construction in order to perfectly balance the performance demands of Thermal Conductivity, Thermal Resistance, Gap … [Read more...]

Two-Component Room Temperature Curing Thermally Conductive And Electrically Insulating Adhesive

 

Ayer, MA, August 2020 New Product – Creative Materials introduces 813-76, a two-component room temperature curing thermally conductive and electrically insulating adhesive.  This product is designed for assembling heat-sensitive components on printed circuit boards, and it develops strong adhesive bonds and excellent thermal transfer.  813-76 provides high impact bonds … [Read more...]

Parker’s THERM-A-GAP GEL 37 Is the Next Generation of Single Component Dispensable Thermal Interface Materials

 

Parker’s THERM-A-GAPTM GEL 37 Is the Next Generation of Single Component Dispensable Thermal Interface Materials Offers improved flow rate control and higher thermal conductivity than THERM-A-GAP GEL 30 Woburn, Mass. – The Chomerics division of Parker Hannifin Corporation, the global leader in motion and control technologies, today announces the launch of THERM-A-GAP GEL … [Read more...]

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