TIMs are vital in optimizing the performance, reliability, and longevity of optical components, such as silicon photonics transceivers in data centers. At Thermal Live Spring 2025, Henkel provided valuable insights into the growing computational demands in data centers and the […]

May 19-23, 2025 at Resorts World Las Vegas Come Prepared. Leave Aligned. We all know how busy EDS week is. With four consecutive days of face-to-face meetings and outings, it’s imperative that you come prepared to ensure the ideas shared […]

By: Aaditya A. Candadai, Aalok Gaitonde, Shanmukhi Sripada, Justin A. Weibel, Amy M. Marconnet Introduction New high thermal conductivity materials have been developed to enable enhanced heat transport within electronics packages and other thermal management applications. Many of these engineered […]

Most engineers involved with temperature measurement know there are several methods for measuring temperatures of fluids and solids. The oldest and most common method for measuring the temperature of a fluid such as air is the standard mercury-in-glass thermometer. However, […]

Abstract The past two decades have seen many approaches to solder fatigue and solder joint life published. This subject has proved difficult as various failure mechanisms are proposed and examined. While these theoretical bases are discussed, it often leaves the […]

Introduction This is the second installment in a series of articles that aims to explore a range of practical topics on radiation that are relevant to those of us focused on electronics cooling and thermal design. The last article [3] […]