Introduction In recent years, the power density of server racks has surged past 100 kW/rack [1] to support compute-intensive workloads such as artificial intelligence and data analytics. Cooling systems play an increasingly important role in enabling such densification improvements and […]

Steady state operating temperature is a critical design parameter for ensuring the reliable operation of modern electronics systems. However, in practice it is but one of many factors that impact overall system health and performance. Modern challenges, like the large […]

High-power cooling in a sub-1.6mm profile provides critical thermal stability for high-density electronics. AUSTIN, TX – To solve the growing challenge of localized hotspots in high-density electronics, Sheetak Inc. has launched its µCENTUM™ series of micro-thermoelectric coolers (TECs). These compact […]

Component reliability testing can lead to an inherent disagreement in what different people hope to see from the results. Designers who want to use the components hope that no components fail during qualification testing to verify that they meet the […]

Chips are getting hotter, and liquid cooling is moving from niche to necessary. That transition changes what “good” looks like for fluid connections. Quick disconnect couplings have long lived in industrial settings, where design tolerances, qualification habits, and manufacturing controls […]

The 31st international workshop on THERMal INvestigations of ICs and systems (THERMINIC) took place on 24–26 September 2025 in Naples, Italy, hosted at the Centro Congressi (Conference Center) of University Federico II. This year’s workshop not only broke attendance records […]