NEC has developed an eco-friendly cooling system for CPUs, said to use 60% less energy than a water-cooling system and even 80% less than an air-cooling system. The core of the system is a liquid chlorofluorocarbon (CFC) substitute, which circulates around the CPU to draw away heat and has low greenhouse effects. NEC says the refrigerant begins boiling at around 50oC, changes … [Read more...]
Compact Water-Circulation System Prevents Stacks of Electronic Chips
A research team from the A*STAR Institute of Microelectronics and Nanyang University in Singapore has designed and built a water circulation system to cool stacks of integrated electrical circuits. “The heat must be removed from microchips to maintain a temperature within acceptable limits: less than 100 °C,” explains team-member Navas Khan from the Institute of … [Read more...]
Intel® Atom™ Processor-Based Platform Uses Significantly Lower Power
Intel Corporation has unveiled its newest Intel® Atom™ processor-based platform. The technology package provides significantly lower power consumption and prepares the company to target a range of computing devices, including high-end smartphones, tablets and other mobile handheld products. The platform has been repartitioned to include the Intel Atom processor Z6xx, which … [Read more...]
ElectronicsCooling Spring 2010 Print Issue
Did you miss us? For those of you that are faithful readers of Electronics Cooling, we are pleased to inform you that after a short interval of restructuring, we have resumed publication. Given the recent downturn in the economy as a whole, and specifically within the electronics thermal management community, we can hope that this is a sign of improvement and recovery. We will … [Read more...]
Thermally Conductive Printed Circuit Board Substrate
Laird Technologies, Inc. recently announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The Tlam SS LLD is a versatile, thermally enhanced PCB substrate system specifically designed for heat dissipation in bright and ultra-bright LED module applications. The thermally conductive PCB substrate provides 8-10 … [Read more...]
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