Electric vehicles (EVs) and hybrid vehicles (HEVs & PHEVs) are becoming increasingly prevalent to reduce the environmental detriments produced by traditional combustion engine (ICE) vehicles. The use of stored electrical energy as opposed to stored chemical energy (gas) requires the use of large battery packs to supply the electric drivetrain, and therefore the electric … [Read more...]
Alloy Enterprises Unveils Copper Direct Liquid Cooling, Slashing AI Data Center Energy Use and Eliminating the Need for HVAC
Alloy Enterprises, a manufacturing company revolutionizing data center cooling with its novel Stack Forging™ process, today introduced a new copper direct liquid cooling (DLC) solution. As chip power densities and thermal design power rise—pushing AI server rack power densities beyond 120 kW—traditional cooling methods are reaching their limits. With Stack Forging, Alloy … [Read more...]
Data Centre Solutions Division From LFB Group Launches Lennox Branded Fan Wall
Adding to its innovative ‘ApX Series’ range of cooling infrastructure for hyperscale and edge data centres, LFB Group has launched its brand new Fan Wall Unit (FWU) - a high-performance, modular solution built to meet the fast-evolving demands of modern computing environments. LFB Group, following its transition from Lennox EMEA in April 2025, brings over sixty years of … [Read more...]
Solving the Heat Dilemma for Optical Transceivers: What’s Next for TIMs?
TIMs are vital in optimizing the performance, reliability, and longevity of optical components, such as silicon photonics transceivers in data centers. At Thermal Live Spring 2025, Henkel provided valuable insights into the growing computational demands in data centers and the associated thermal stress risks, highlighting how their thermal interface materials are addressing … [Read more...]
Measuring the Thermal Conductivity of Anisotropic Heat Spreading Materials
By: Aaditya A. Candadai, Aalok Gaitonde, Shanmukhi Sripada, Justin A. Weibel, Amy M. Marconnet Introduction New high thermal conductivity materials have been developed to enable enhanced heat transport within electronics packages and other thermal management applications. Many of these engineered materials have anisotropic thermal properties inherent to their fabrication, … [Read more...]
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